Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO1991006389) METHOD AND DEVICE FOR LASER BRAZING
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1991/006389 International Application No.: PCT/FR1990/000731
Publication Date: 16.05.1991 International Filing Date: 12.10.1990
IPC:
B23K 1/005 (2006.01) ,B23K 26/03 (2006.01) ,H05K 3/34 (2006.01)
[IPC code unknown for B23K 1/05]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
03
Observing the workpiece
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
QUANTEL S.A. [FR/FR]; Avenue de l'Atlantique Z.A. de Courtab÷uf F-91941 Les Ulis-Orsay Cédex, FR (AllExceptUS)
COTTIN, Patrice [FR/FR]; FR (UsOnly)
GUIVY, Patrick [FR/FR]; FR (UsOnly)
Inventors:
COTTIN, Patrice; FR
GUIVY, Patrick; FR
Agent:
JACOBSON, Claude; Cabinet Lavoix 2, place d'Estienne-d'Orves F-75441 Paris Cédex 09, FR
Priority Data:
89/1393724.10.1989FR
Title (EN) METHOD AND DEVICE FOR LASER BRAZING
(FR) PROCEDE ET APPAREIL DE BRASAGE AU LASER
Abstract:
(EN) A series of connection pins on a non metallic substrate (2) is brazed simultaneously by sweeping a laser beam over a region of the substrate next to the set of pins. Application is found in the manufacture of electronic circuit boards.
(FR) On brase simultanément une série de broches de connexion sur un substrat (2) non métallique en balayant au moyen d'un faisceau laser une région du substrat située à proximité de l'ensemble des broches. Application à la fabrication des cartes de circuits électroniques.
Designated States: US
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LU, NL, SE)
Publication Language: French (FR)
Filing Language: French (FR)