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1. WO1991000619 - FLYING LEADS FOR INTEGRATED CIRCUITS

Publication Number WO/1991/000619
Publication Date 10.01.1991
International Application No. PCT/US1990/003572
International Filing Date 22.06.1990
Chapter 2 Demand Filed 07.12.1990
IPC
H01L 23/538 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/065 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/78
CPC
H01L 2224/1134
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
11Manufacturing methods
113by local deposition of the material of the bump connector
1133in solid form
1134Stud bumping, i.e. using a wire-bonding apparatus
H01L 2224/13099
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
12Structure, shape, material or disposition of the bump connectors prior to the connecting process
13of an individual bump connector
13001Core members of the bump connector
13099Material
H01L 2224/13144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
12Structure, shape, material or disposition of the bump connectors prior to the connecting process
13of an individual bump connector
13001Core members of the bump connector
13099Material
131with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
13138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
13144Gold [Au] as principal constituent
H01L 2224/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
H01L 2224/45015
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
4501Shape
45012Cross-sectional shape
45015being circular
H01L 2224/45144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
45144Gold (Au) as principal constituent
Applicants
  • RAYCHEM CORPORATION [US/US]; 300 Constitution Drive Menlo Park, CA 94025, US
Inventors
  • CRAY, Seymour, R.; US
  • KRAJEWSKI, Nicholas, J.; US
Agents
  • BURKARD, Herbert, G.; Raychem Corporation Intellectual Property Law Dept. Mail Stop 120/6600 300 Constitution Drive Menlo Park, CA 94025-1164, US
Priority Data
376,15630.06.1989US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) FLYING LEADS FOR INTEGRATED CIRCUITS
(FR) FILS VOLANTS POUR CIRCUITS INTEGRES
Abstract
(EN)
A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice (104) directly to circuit boards (110) by ball bonding gold wires (101) to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the dice and inserting the gold leads into through-plated holes (111) of circuit boards (110) which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.
(FR)
L'invention concerne un procédé et un appareil d'interconnexion de circuits électroniques utilisant de l'or recuit tendre presque pur, mécaniquement comprimé dans des trous de passage galvanisés. L'invention trouve son application dans la fixation d'une matrice de circuits intégrés (104) directement sur des plaquettes de circuits (110) à l'aide de fils d'or (101) à soudure par écrasement de boule, sur les plots de connexion de la matrice de circuits intégrés, dans une relation perpendiculaire aux surfaces de ladite matrice, et dans l'insertion desdits fils d'or dans des trous de passage galvanisés (111) de plaquettes de circuits (110), lesquels assurent une connexion électrique et mécanique une fois que les fils sont comprimés à l'intérieur desdits trous de passage galvanisés. L'invention trouve également son application dans l'interconnexion d'ensembles de plaquettes de circuits en sandwich, dans lesquels des fils conducteurs en or sont insérés dans des trous de passage galvanisés alignés axialement desdites plaquettes de circuits, et sont comprimés de sorte que lesdits fils conducteurs en or se compriment et se gauchissent à l'intérieur des trous de passage galvanisés, formant une connexion électrique entre les plaquettes de circuits.
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