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1. WO1991000464 - SEMICONDUCTOR MICROACTUATOR

Publication Number WO/1991/000464
Publication Date 10.01.1991
International Application No. PCT/US1990/003529
International Filing Date 21.06.1990
Chapter 2 Demand Filed 22.01.1991
IPC
F15C 5/00 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
15FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
CFLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
5Manufacture of fluid-circuit elements; Manufacture of assemblages of such elements
G02B 26/00 2006.01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
26Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating or modulating
CPC
F15C 5/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
15FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
CFLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
5Manufacture of fluid circuit elements; Manufacture of assemblages of such elements ; integrated circuits
F16K 2099/0074
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
99Subject matter not provided for in other groups of this subclass
0073Fabrication methods specifically adapted for microvalves
0074using photolithography, e.g. etching
F16K 2099/008
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
99Subject matter not provided for in other groups of this subclass
0073Fabrication methods specifically adapted for microvalves
008Multi-layer fabrications
F16K 99/0001
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
99Subject matter not provided for in other groups of this subclass
0001Microvalves
F16K 99/0009
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
99Subject matter not provided for in other groups of this subclass
0001Microvalves
0003Constructional types of microvalves; Details of the cutting-off member
0005Lift valves
0009the valve element held by multiple arms
F16K 99/0015
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
99Subject matter not provided for in other groups of this subclass
0001Microvalves
0003Constructional types of microvalves; Details of the cutting-off member
0015Diaphragm or membrane valves
Applicants
  • IC SENSORS, INC. [US/US]; 1701 McCarthy Boulevard Milpitas, CA 95035, US
Inventors
  • JERMAN, John, Hallock; US
Agents
  • WATT, Phillip, H. ; Fitch, Even, Tabin & Flannery Room 900 135 South LaSalle Street Chicago, IL 60603, US
Priority Data
370,54523.06.1989US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SEMICONDUCTOR MICROACTUATOR
(FR) MICROACTIONNEUR A SEMICONDUCTEUR
Abstract
(EN)
A semiconductor microactuator (10, 310) has a silicon semiconductor substrate (12, 302) having suspension means (14, 304) connected thereto. The suspension means (14, 304) has a first layer of material (28, 328) having a first thermal expansion coefficient and a second layer of material (36, 336) having a second thermal expansion different than the first thermal expansion coefficient and may be a part of a diaphragm or a pair of connecting members. A movable element (26, 326) which may be a second part of the diaphragm (22, 322) or a boss, is connected to the suspension to be displaced thereby as the temperature of the first and second layers of material is varied. The displacement is solely irrotational with respect to the semiconductor substrate.
(FR)
Un microactionneur à semiconducteur (10, 310) comprend un substrat à semiconducteur au silicium (12, 302) auquel sont reliés des moyens de suspension (14, 304). Les moyens de suspension (14, 304) comprennent une première couche de matière (28, 328) présentant un premier coefficient de dilatation thermique ainsi qu'une deuxième couche de matière (36, 336) présentant un deuxième coefficient de dilatation thermique différent du premier, lesdits moyens pouvant faire partie d'un diaphragme ou d'une paire d'organes de raccordement. Un élément mobile (26, 326), sous forme soit d'une deuxième partie dudit diaphragme (22, 322) soit d'une bosse, est relié à la suspension devant être déplacée par ledit élément mobile, lors de variations dans la température des première et deuxième couches de matière. Ledit déplacement est irrotationnel uniquement par rapport au substrat de semiconducteur.
Also published as
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