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1. WO1990012904 - PROCESS FOR PREPARING THE THROUGH HOLE WALLS OF A PRINTED WIRING BOARD FOR ELECTROPLATING

Publication Number WO/1990/012904
Publication Date 01.11.1990
International Application No. PCT/US1990/000041
International Filing Date 09.01.1990
Chapter 2 Demand Filed 09.10.1990
IPC
C25D 5/54 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
54Electroplating of non-metallic surfaces
H05K 3/38 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
38Improvement of the adhesion between the insulating substrate and the metal
H05K 3/42 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes
CPC
C25D 5/54
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
54Electroplating ; on; non-metallic surfaces ; , e.g. on carbon or carbon composites
H05K 2201/0323
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
032Materials
0323Carbon
H05K 2203/122
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
12Using specific substances
122Organic non-polymeric compounds, e.g. oil, wax, thiol
H05K 3/383
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
38Improvement of the adhesion between the insulating substrate and the metal
382by special treatment of the metal
383by microetching
H05K 3/424
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes ; or plated via connections
423characterised by electroplating method
424by direct electroplating
H05K 3/427
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes ; or plated via connections
425characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
427initial plating of through-holes in metal-clad substrates
Applicants
  • OLIN HUNT SPECIALTY PRODUCTS INC. [US]/[US]
Inventors
  • PIANO, Anthony, M.
  • GALVEZ, Randolfo
Agents
  • CARLSON, Dale, L.
Priority Data
342,49224.04.1989US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PROCESS FOR PREPARING THE THROUGH HOLE WALLS OF A PRINTED WIRING BOARD FOR ELECTROPLATING
(FR) PROCEDE DE PREPARATION DES PAROIS DES TROUS TRAVERSANTS D'UNE CARTE DE CONNEXIONS IMPRIMEES EN VUE DE LEUR ELECTROPLACAGE
Abstract
(EN)
In the process for electroplating the walls of through holes in a laminated printed wiring board comprised of at least one nonconducting layer laminated to at least two separate conductive metal layers, which comprises the steps: (a) contacting said printed wiring board with a liquid dispersion of carbon black comprised of: (1) carbon black particles having an average particle size of less than about 3.0 microns; (2) an effective dispersing amount of a surfactant; and (3) a liquid dispersing medium, wherein the amount of carbon black is less than about 4 % by weight of said liquid dispersion; (b) separating substantially all of the liquid dispersing medium from said applied dispersion; (c) microetching said metal layers; (e) electroplating a substantially continuous metal layer over the deposited carbon black layer wherein said improvement is characterized by: contacting said deposited carbon black particles after step (b) and before step (c) with aqueous alkaline solution of an alkali metal borate.
(FR)
Le procédé décrit, qui permet d'électroplaquer les parois des trous traversants dans une carte de connexions imprimées stratifiée, qui est composée d'au moins une couche non conductrice déposée par stratification sur au moins deux couches métalliques conductrices séparées, consiste: (a) à mettre en contact la carte de connexions imprimées avec une dispersion liquide de noir de carbone composée: (1) de particules de noir de carbone ayant une granulométrie moyenne inférieure à 3,0 microns environ; (2) d'une quantité dispersante efficace d'un agent tensioactif; et (3) d'un milieu dispersant liquide, dans lequel la quantité de noir de carbone est inférieure à environ 4 % en poids de la dispersion liquide; (b) à séparer essentiellement la totalité du milieu dispersant liquide de ladite dispersion appliquée; (c) à micro-attaquer les couches métalliques; (e) et à électroplaquer une couche de métal sensiblement continue sur la couche de noir de carbone déposée; l'amélioration étant caractérisée en ce que les particules de noir de carbone déposées sont mises en contact après l'étape (b) et avant l'étape (c) avec une solution alcaline d'un borate de métal alcalin.
Also published as
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