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1. WO1990012695 - COMPOSITION FOR A SOLDER MASK, PRODUCT THEREOF AND PROCESS FOR USING SAME

Publication Number WO/1990/012695
Publication Date 01.11.1990
International Application No. PCT/US1990/002137
International Filing Date 17.04.1990
IPC
C08L 71/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
71Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
H05K 1/09 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the metallic pattern
H05K 3/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
20by affixing prefabricated conductor pattern
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
CPC
C08L 71/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
71Compositions of polyethers obtained by reactions forming an ether link in the main chain
H05K 1/095
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the ; conductive, e.g. ; metallic pattern
092Dispersed materials, e.g. conductive pastes or inks
095for polymer thick films, i.e. having a permanent organic polymeric binder
H05K 2201/0129
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0104Properties and characteristics in general
0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
H05K 2201/0166
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0137Materials
0166Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
H05K 2201/0209
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
02Fillers; Particles; Fibers; Reinforcement materials
0203Fillers and particles
0206Materials
0209Inorganic, non-metallic particles
H05K 2203/0537
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
05Patterning and lithography; Masks; Details of resist
0502Patterning and lithography
0537Transfer of pre-fabricated insulating pattern
Applicants
  • AMOCO CORPORATION [US]/[US]
Inventors
  • SALENSKY, George, Anthony
  • THOMAN, Thomas, Steven
Agents
  • MICKELSON, Carole, A.
Priority Data
343,74427.04.1989US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) COMPOSITION FOR A SOLDER MASK, PRODUCT THEREOF AND PROCESS FOR USING SAME
(FR) COMPOSITION POUR UN MASQUE DE SOUDURE, SON PRODUIT ET PROCEDE D'UTILISATION
Abstract
(EN)
This invention relates to a solder mask composition for thermoplastic substrates. The solder mask has critical components which include a polyhydroxyether and melamine formaldehyde. Other components include a solvent, filler and flow control agent. Optional ingredients include a colorant, epoxy resin and acid to promote the reaction of the composition. A surfactant can also be included. The solder mask provides the necessary flexibility and adhesion required for thermoplastic circuit boards. The mask can be applied directly to a circuit board or to a transfer medium for subsequent covering of a substrate. It relates to an article which can be a circuit board. It also relates to a process for making such composites which includes processing the solder mask.
(FR)
Cette invention concerne une composition d'un masque de soudure pour des substrats thermoplastiques. Le masque de soudure possède des composants critiques qui comprennent un polyhydroxyéther et une formaldéhyde de mélanine. D'autres composants consistent en un solvant, un matériau de charge et un agent de régulation de la fluidité. D'éventuels ingrédients sont un colorant, une résine époxyde et de l'acide pour contribuer à la réaction de la composition. Un agent tensio-actif peut également être incorporé. Le masque de soudure confère aux plaquettes de circuit thermoplastiques la flexibilité et l'adhésion nécessaires. Le masque peut être appliqué directement sur une plaquette de circuit ou sur un milieu de transfert pour le recouvrement ultérieur d'un substrat. Elle concerne un article qui peut être une plaque à circuit imprimé. Elle concerne également un procédé de fabrication de tels composites qui inclut le traitement du masque de soudure.
Also published as
Latest bibliographic data on file with the International Bureau