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Machine translation
1. (WO1990009093) EXTENDED INTEGRATION SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING THE SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1990/009093    International Application No.:    PCT/US1990/000069
Publication Date: 23.08.1990 International Filing Date: 10.01.1990
Chapter 2 Demand Filed:    20.08.1990    
IPC:
H01L 21/66 (2006.01), H01L 21/68 (2006.01)
Applicants: POLYLITHICS, INC. [US/US]; 3450 Central Expressway, Santa Clara, CA 95051 (US)
Inventors: JACOBS, Scott, Laurence; (US)
Agent: FLEIT, Martin; Fleit, Jacobson, Cohn, Price, Holman & Stern, The Jenifer Building, 400 Seventh Street, Washington, DC 20004 (US)
Priority Data:
301,792 25.01.1989 US
Title (EN) EXTENDED INTEGRATION SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING THE SAME
(FR) STRUCTURE SEMI-CONDUCTRICE A INTEGRATION POUSSEE ET PROCEDE POUR SA FABRICATION
Abstract: front page image
(EN)A low cost, lightweight, fast, dense and reliable extended integration semiconductor structure is provided by forming a thin film multilayer wiring decal (15) on a support substrate and aligning and attaching one or more integrated chips to the decal. A support ring (33) is attached to the decal surrounding the aligned and attached integrated substrate, and the substrate is removed. Reach-through vias connect the decal wiring to the chips.
(FR)Une structure semi-conductrice à intégration poussée, peu onéreuse, légère, rapide, dense et fiable est réalisée par la formation d'une décalcomanie de câblage multicouche (15) à couche mince sur un substrat de support et par l'alignement et la fixation, sur la décalcomanie, d'une ou de plusieurs puces intégrées. Un anneau de support (33) est fixé à la décalcomanie entourant le substrat intégré aligné et fixé, et le substrat de support est enlevé. Des interconnexions traversantes relient la décalcomanie de câblage aux puces.
Designated States: AU, BB, BG, BR, CA, FI, HU, JP, KP, KR, LK, MC, MG, MW, NO, RO, SD, SU.
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, IT, LU, NL, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CM, GA, ML, MR, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)