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Machine translation
1. (WO1990009035) CHIP CARRIER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1990/009035    International Application No.:    PCT/JP1990/000138
Publication Date: 09.08.1990 International Filing Date: 05.02.1990
IPC:
H01L 23/13 (2006.01), H01L 23/495 (2006.01), H01L 23/498 (2006.01), H05K 1/02 (2006.01), H05K 1/18 (2006.01)
Applicants: FURUKAWA DENKI KOGYO KABUSHIKI KAISHA [JP/JP]; 6-1, Marunouchi 2-chome, Chiyoda-ku, Tokyo 100 (JP) (For All Designated States Except US).
OHTANI, Kenichi [JP/JP]; (JP) (For US Only)
Inventors: OHTANI, Kenichi; (JP)
Agent: SATO, Masatoshi; Sanwa International Patent Office, Shuwa Daini Toranomon Bldg., 21-19, Toranomon 1-chome, Minato-ku, Tokyo 105 (JP)
Priority Data:
1/25677 06.02.1989 JP
1/55220 09.03.1989 JP
Title (EN) CHIP CARRIER
(FR) SUPPORT DE PUCE
Abstract: front page image
(EN)This invention relates to a chip carrier for mounting a semiconductor device chip (6) in which a predetermined metal wiring (1) is formed on the surface of a flexible film member (2), wherein the film member (2) of a first region that includes an inner lead portion (1a) of the metal wiring (1) and that surrounds the region on which the chip (6) is mounted has a thickness less than the second thickness of the region surrounding the first region.
(FR)L'invention concerne un support de puce pour le montage d'une puce (6) de dispositif à semi-conducteurs, dans lequel un câblage métallique prédéterminé (1) est formé sur la surface d'un film souple (2), ledit film (2) d'une première région comprenant une partie intérieure (1a) de fil du câblage métallique (1) et entourant la région sur laquelle la puce (6) est montée, ayant une épaisseur inférieure à la seconde épaisseur de la région entourant ladite première région.
Designated States: CA, JP, KR, US.
European Patent Office (AT, BE, CH, DE, DK, ES, FR, GB, IT, LU, NL, SE).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)