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1. WO1990003100 - PRINTED CIRCUIT BOARDS AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS

Publication Number WO/1990/003100
Publication Date 22.03.1990
International Application No. PCT/US1988/003102
International Filing Date 02.09.1988
Chapter 2 Demand Filed 17.01.1990
IPC
H05K 1/11 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
H05K 3/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
20by affixing prefabricated conductor pattern
H05K 3/24 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
24Reinforcing of the conductive pattern
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
H05K 3/40 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
H05K 3/42 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes
CPC
H05K 1/112
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
111Pads for surface mounting, e.g. lay-out
112directly combined with via connections
H05K 2201/0367
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0364Conductor shape
0367Metallic bump or raised conductor not used as solder bump
H05K 2201/0394
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0388Other aspects of conductors
0394Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
H05K 2201/09472
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
09372Pads and lands
09472Recessed pad for surface mounting
H05K 2201/09563
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
09563Metal filled via
H05K 2203/0152
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
01Tools for processing; Objects used during processing
0147Carriers and holders
0152Temporary metallic carrier, e.g. for transferring material
Applicants
  • WESTINGHOUSE ELECTRIC CORPORATION [US]/[US]
Inventors
  • KING, David, R.
  • LEE, Mark, S.
  • DECKER, Richard, W.
Agents
  • SUTCLIFF, W., G.
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PRINTED CIRCUIT BOARDS AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS
(FR) CARTES DE CIRCUITS IMPRIMES ET PROCEDE POUR LA FABRICATION
Abstract
(EN)
The method for fabricating the board includes as a first step the fabrication of a first board panel (10) having a raised electrically conducting first circuit pattern (15) extending from a base layer (14) of conductive material and a raised electrically conducting second circuit pattern (20) extending from the first circuit pattern (15). A second board panel (30) is also fabricated, having a raised electrically conducting third circuit pattern (35) extending from another base layer (34) of conductive material. The first board panel (10) is laminated to the second board panel (30) with a laminate insulating material (40) disposed therebetween electrically insulating the first circuit pattern (15) from the third circuit pattern (35) and with the second circuit pattern (20) electrically contacting the first circuit pattern (15) at selected portions thereof. Finally, the base layers (14, 34) of conductive material are removed from the laminate insulating material (40).
(FR)
Le procédé décrit consiste, dans une première étape, à fabriquer un premier panneau de carte (10) possédant une première configuration de circuit (15) électroconducteur en relief, partant d'une couche de base (14) de matériau conducteur, et une deuxième configuration de circuit (20) électroconducteur en relief, partant de la première configuration de circuit (15). On fabrique ensuite un deuxième panneau de carte (30) présentant une troisième configuration de circuit (35) électroconducteur en relief, qui part d'une autre couche de base (34) de matériau conducteur. Le premier panneau de carte (10) est stratifié sur le deuxième panneau de carte (30), un matériau isolant (40) étant disposé entre les deux pour isoler électriquement la première configuration de circuit (15) de la troisième configuration de circuit (35), la deuxième configuration de circuit (20) étant en contact électrique avec la première configuration de circuit (15) à des emplacements choisis de celui-ci. Pour finir, les couches de base (14, 34) de matériau conducteur sont ôtées du matériau isolant stratifié (40).
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