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Machine translation
1. (WO1990002712) GLASS/CERAMIC SEALING SYSTEM
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1990/002712    International Application No.:    PCT/US1989/003630
Publication Date: 22.03.1990 International Filing Date: 23.08.1989
Chapter 2 Demand Filed:    19.03.1990    
IPC:
C03C 3/078 (2006.01), C03C 3/085 (2006.01), C03C 3/102 (2006.01), C03C 3/105 (2006.01), C03C 8/24 (2006.01), C03C 10/00 (2006.01), H01L 23/10 (2006.01)
Applicants: OLIN CORPORATION [US/US]; 350 Knotter Drive, P.O. Box 586, Cheshire, CT 06410-0586 (US)
Inventors: CHERUKURI, Satyam, C.; (US)
Agent: ROSENBLATT, Gregory, S.; Olin Corporation, 350 Knotter Drive, P.O. Box 586, Cheshire, CT 06410-0586 (US)
Priority Data:
239,891 02.09.1988 US
Title (EN) GLASS/CERAMIC SEALING SYSTEM
(FR) SYSTEME D'ETANCHEIFICATION VERRE/CERAMIQUE
Abstract: front page image
(EN)The present invention relates to a glass/ceramic sealing system (54). A sealing glass (54) having a coefficient of thermal expansion in excess of 160 x 10-7 cm/cm/°C is provided. The glass is useful for matched sealing of copper and copper based alloys (52). The glass (54) is capable of ceramization, greatly increasing the resistance of the glass to moisture penetration and fracture due to mechanical damage. The temperature of ceramization has been designed so that a solutionized copper alloy leadframe (20) is age hardened during ceramization. The glass has particular utility in the manufacture of electronic packages (12) and multi-layer circuitry.
(FR)Système d'étanchéification verre/céramique (54) et verre d'étanchéification (54) dont le coefficient de dilatation thermique dépasse 160 x 10-7 cm/cm/°C. Ce verre peut donc servir à l'étanchéification du cuivre et des alliages de cuivre (52), dont il épouse les caractéristiques de comportement. Ce verre (54) peut être céramisé, ce qui le rend nettement plus imperméable à l'humidité et plus résistant aux cassures d'origine mécanique. La température de céramisation est choisie de manière que la céramisation entraîne le durcissement par vieillissement d'un cadre de montage (20) en alliage de cuivre solutionisé ('solutionized'). Ce verre est particulièrement utile pour la fabrication de boîtiers électroniques (12) et de circuits multicouches.
Designated States: AU, BB, BG, BR, DK, FI, HU, JP, KP, KR, LK, MC, MG, MW, NO, RO, SD, SU.
European Patent Office (AT, BE, CH, DE, FR, GB, IT, LU, NL, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CM, GA, ML, MR, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)