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1. WO1989007999 - PROCESS FOR RESISTANCE DIFFUSION JUNCTION

Publication Number WO/1989/007999
Publication Date 08.09.1989
International Application No. PCT/JP1989/000172
International Filing Date 21.02.1989
IPC
B23K 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
B23K 1/20 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
B23K 11/11 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
11Resistance welding; Severing by resistance heating
10Spot welding; Stitch welding
11Spot welding
CPC
B23K 1/0004
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
0004Resistance soldering
B23K 1/20
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
B23K 11/115
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
11Resistance welding; Severing by resistance heating
10Spot welding; Stitch welding
11Spot welding
115by means of two electrodes placed opposite one another on both sides of the welded parts
H01L 2224/291
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
29001Core members of the layer connector
29099Material
291with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
H01L 2224/29171
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
29001Core members of the layer connector
29099Material
291with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
29163the principal constituent melting at a temperature of greater than 1550°C
29171Chromium [Cr] as principal constituent
H01L 2224/83825
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
83using a layer connector
838Bonding techniques
83801Soldering or alloying
8382Diffusion bonding
83825Solid-liquid interdiffusion
Applicants
  • KABUSHIKI KAISHA KOMATSU SEISAKUSHO [JP]/[JP] (AllExceptUS)
  • KURIYAMA, Kazuya; [JP]/[JP] (UsOnly)
  • KATADA, Kanji; [JP]/[JP] (UsOnly)
Inventors
  • KURIYAMA, Kazuya;
  • KATADA, Kanji;
Agents
  • YONEHARA, Masaaki @
Priority Data
63/20659319.08.1988JP
63/4663929.02.1988JP
63/7519029.03.1988JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PROCESS FOR RESISTANCE DIFFUSION JUNCTION
(FR) PROCEDE DE REALISATION D'UNE JONCTION A DIFFUSION PAR RESISTANCE
Abstract
(EN)
A process for resistance diffusion junction, which can be accomplished in a short time using simple equipment without exerting thermal influences on base metals to be joined and in which a high junction strength is attained by sufficient diffusion of an insert material provided between the surfaces of the base metals to be joined. The process involves a step of providing an insert material between the junction surfaces of a set of base metals to be joined present in close proximity, a step of melting the insert material between the junction surfaces and expelling excess insert material to form a thin-film insert material liquid phase by resistance heat generated by applying voltage across electrodes provided on the other side of each base metal and an applied pressure, and a step of diffusing the insert material at the junction surfaces. In order to prevent generation of Joule heat from the electrodes, an electroconductive heat-insulating material is provided between at least one of the base metals and the corresponding electrode. In addition, displacement during junction of the base metals is measured to control the pressure and quantity of electricity supplied through the electrodes based on the measured displacement value.
(FR)
Procédé de réalisation d'une jonction à diffusion par résistance, pouvant être effectuée rapidement en utilisant un équipement simple sans exercer d'influences thermiques sur les métaux de base à relier et présentant une résistance élevée, obtenue par une diffusion suffisante d'un matériau rapporté situé entre les surfaces des métaux de base à relier. Le procédé consiste à placer un matériau rapporté entre les surfaces de jonction d'un ensemble de métaux de base à relier situés à proximité l'un de l'autre, à fondre le matériau rapporté entre les surfaces de jonction et à expulser le matériau rapporté excédentaire pour former une phase liquide à pellicule mince de matériau rapporté par la chaleur de résistance produite par l'application d'une tension sur les électrodes placées sur l'autre côté de chaque métal de base et par l'application d'une pression, et à diffuser le matériau rapporté au niveau des surfaces de jonction. Afin d'empêcher la production de chaleur par effet Joule de la part des électrodes, on dispose un matériau thermo-isolant électroconducteur entre au moins l'un des métaux de base et l'électrode correspondante. En outre, on mesure le déplacement pendant la jonction des métaux de base, pour réguler la pression et la quantité d'électricité appliquée par les électrodes en fonction de la valeur de déplacement mesurée.
Also published as
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