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1. (WO1989000586) PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1989/000586 International Application No.: PCT/JP1988/000669
Publication Date: 26.01.1989 International Filing Date: 05.07.1988
IPC:
C08F 299/06 (2006.01) ,G03F 7/027 (2006.01) ,G03F 7/039 (2006.01) ,H05K 3/00 (2006.01) ,H05K 3/28 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
299
Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
02
from unsaturated polycondensates
06
from polyurethanes
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
039
Macromolecular compounds which are photodegradable, e.g. positive electron resists
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
Applicants:
MITSUBISHI DENKI KABUSHIKI KAISHA [JP/JP]; 2-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100, JP (AllExceptUS)
MITSUBISHI RAYON CO., LTD. [JP/JP]; 3-19, Kyobashi 2-chome Chuo-ku Tokyo 104, JP (AllExceptUS)
KUBOTA, Shigeru [JP/JP]; JP (UsOnly)
MASUI, Katsue [JP/JP]; JP (UsOnly)
MORIWAKI, Toshimoto [JP/JP]; JP (UsOnly)
ANDO, Torahiko [JP/JP]; JP (UsOnly)
Inventors:
KUBOTA, Shigeru; JP
MASUI, Katsue; JP
MORIWAKI, Toshimoto; JP
ANDO, Torahiko; JP
Agent:
OIWA, Masuo; Mitsubishi Denki Kabushiki Kaisha 2-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100, JP
Priority Data:
62/17147609.07.1987JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT
(FR) COMPOSITION A BASE D'UNE RESINE PHOTOSENSIBLE ET ELEMENT PHOTOSENSIBLE
Abstract:
(EN) A photosensitive resin composition which has heat and chemical resistance, can be used for, particularly, forming protective film for chemical plating, and shows an improved solder heat resistance. This composition contains (a) polyurethane poly(meth)acrylate, (aa) bisphenol epoxy (meth)acrylate, (b) a linear high-molecular compound, and (c) a polymerization initiator capable of producing free radicals when irradiated with light. This composition is used for producing a printed wiring board according to the additive method.
(FR) Une composition à base d'une résine photosensible possédant une résistance thermique et chimique peut notamment être utilisée pour former un film protecteur en vue du revêtement chimique, et présente une meilleure résistance thermique à la soudure. Cette composition contient (a) du poly(méth)acrylate de polyuréthane, (aa) du (méth)acrylate époxyde de bisphénol, (b) un composé linéaire de poids moléculaire élevé, et (c) un initiateur de polymérisation pouvant former des radicaux libres lorsqu'il est soumis à une radiation lumineuse. Cette composition est utilisée pour produire une carte de câblage imprimée par le procédé additif.
Designated States: DE, GB, KR, US
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
US4988605KR1019897001652