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1. (WO1989000338) SEMICONDUCTOR CASING
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1989/000338 International Application No.: PCT/US1988/002089
Publication Date: 12.01.1989 International Filing Date: 27.06.1988
Chapter 2 Demand Filed: 21.02.1989
IPC:
H01L 23/057 (2006.01) ,H01L 23/10 (2006.01) ,H01L 23/14 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
04
characterised by the shape
053
the container being a hollow construction and having an insulating base as a mounting for the semiconductor body
057
the leads being parallel to the base
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
10
characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
14
characterised by the material or its electrical properties
Applicants:
OLIN CORPORATION [US/US]; 350 Knotter Drive P.O. Box 586 Cheshire, CT 06410, US
Inventors:
CHERUKURI, Satyam, C.; US
BUTT, Sheldon, H.; US
Agent:
ROSENBLATT, Gregory, S. @; Olin Corporation 350 Knotter Drive Cheshire, CT 06410, US
Priority Data:
069,12502.07.1987US
Title (EN) SEMICONDUCTOR CASING
(FR) BOÎTIER SEMI-CONDUCTEUR
Abstract:
(EN) A hermetic semiconductor casing (10) for an electrical component (26) has a metal or metal alloy leadframe (18). The leadframe (18) is bonded by means of a fired glass or ceramic (24) to a metal or metal alloy base member (12). The base member (12) has a relatively thin metal or metal alloy coating (40) on at least the top surface and the sides thereof, with the coating having a desirable refractory oxide layer on the outer surface (42) thereof. The leadframe (18) is also bonded to a metal or metal alloy cap member (30). The coating (40) on the base member (12) allows use of a base member (12) that has undesirable oxide forming characteristics. The coating (40) thinness improves heat transfer and the oxide layer on the sides of the base member (12) provides for bonding to any glass (24) that may flow over the edge of the base during firing that could otherwise break or spall off.
(FR) Boîtier (10) semi-conducteur hermétique destiné à un composant (26) électrique doté d'un cadre de montage (18) métallique ou en alliage métallique. Le cadre de montage (18) est lié au moyen de verre ou de céramique (24) cuit, à un élément (12) servant de base. L'élément (12) servant de base est recouvert d'un enrobage (40) métallique ou d'alliage métallique relativement mince sur au moins la surface supérieure des côtés de celui-ci, l'enrobage comportant, sur sa surface extérieure (42) une couche d'oxyde réfractaire avantageuse. Le cadre de montage (18) est également lié à un élément de couverture (30) métallique ou en alliage métallique. L'enrobage (40) se trouvant sur l'élément (12) servant de base permet l'utilisation d'un élément (12) servant de base présentant des caractéristiques indésirables de formation d'oxyde. La minceur d'enrobage (40) améliore le transfert thermique, et la couche d'oxyde se trouvant sur les côtés de l'élément (12) servant de base assure la liaison au cas où du verre (24) déborderait du bord de la base pendant le chauffage, verre qui pourrait alors se casser ou s''écailler.
Designated States: AU, BB, BG, BR, DK, FI, HU, JP, KP, KR, LK, MC, MG, MW, NO, RO, SD, SU
European Patent Office (AT, BE, CH, DE, FR, GB, IT, LU, NL, SE)
African Intellectual Property Organization (BJ, CF, CG, CM, GA, ML, MR, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0366711KR1019970005705*KR1019907000406AU1988020847