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1. (WO1989000337) ENCAPSULATION BARRIER FOR THICK-FILM HYBRID CIRCUITS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1989/000337 International Application No.: PCT/US1988/002058
Publication Date: 12.01.1989 International Filing Date: 20.06.1988
Chapter 2 Demand Filed: 18.01.1989
IPC:
H01L 21/56 (2006.01) ,H01L 31/0203 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
0203
Containers; Encapsulations
Applicants:
EASTMAN KODAK COMPANY [US/US]; 343 State Street Rochester, NY 14650, US
Inventors:
SCHMIDT, John, David; US
MAURINUS, Martin, Arthur; US
Agent:
KAUFMAN, Stephen, C.; 343 State Street Rochester, NY 14650, US
Priority Data:
067,74329.06.1987US
Title (EN) ENCAPSULATION BARRIER FOR THICK-FILM HYBRID CIRCUITS
(FR) BARRIERE D'ENCAPSULAGE POUR CIRCUITS HYBRIDES EN COUCHE EPAISSE
Abstract:
(EN) A method of encapsulating an electronic device (20) on a substrate (10) comprises depositing a radiatively curable barrier wall (14) to contain a subsequently deposited encapsulant (32). Alternatively, an encapsulant comprising a majority of radiatively curable material is used in the absence of a barrier wall.
(FR) Procédé permettant d'encapsuler un dispositif (20) électronique sur un substrat (10), consistant à déposer une paroi d'arrêt (14) polymérisable sous l'effet d'un rayonnement, destinée à contenir une capsule (32) déposée ultérieurement. Dans un autre mode de réalisation, on utilise une capsule comprenant principalement une matière polymérisable sous l'effet d'un rayonnement, en l'absence de paroi d'arrêt.
Designated States: JP
European Patent Office (DE, FR, GB)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0356465