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1. (WO1989000075) PROCESS FOR PREPARING PLASTIC ELECTROCOATED EMI/RFI SHIELDING
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1989/000075 International Application No.: PCT/US1988/002219
Publication Date: 12.01.1989 International Filing Date: 29.06.1988
IPC:
B05D 3/02 (2006.01) ,C25D 13/20 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
3
Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
02
by baking
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
13
Electrophoretic coating
20
Pretreatment
Applicants:
CROWN CITY PLATING COMPANY [US/US]; 4350 Temple City Boulevard El Monte, CA 91733, US
Inventors:
COOMBES, Robert, L., Jr.; US
Agent:
DILLARD, David, A.; Christie, Parker & Hale 350 West Colorado Boulevard Post Office Box 7068 Pasadena, CA 91109-7068, US
Priority Data:
067,93629.06.1987US
Title (EN) PROCESS FOR PREPARING PLASTIC ELECTROCOATED EMI/RFI SHIELDING
(FR) PROCEDE DE PREPARATION DE BLINDAGE EMI/RFI ELECTROLAQUE EN PLASTIQUE
Abstract:
(EN) A process for electrocoating plastic substrates comprises mounting the plastic substrate onto a plating rack and then electrolessly plating the substrate. The electrolessly plated substrate is then mounted on a second rack and immersed in a cathodic electrocoating solution wherein a non-conductive paint coating deposits onto the substrate. The non-conductive paint coating is then cured by baking at a temperature sufficient to cure the coating, yet insufficient to cause the substrate to deform.
(FR) Procédé d'électrolaquage de substrats en plastique consistant à monter le substrat en plastique sur un montage porte-pièce et ensuite à galvaniser le substrat sans courant. Ensuite on monte le substrat galvanisé sans courant sur un second montage porte-pièce et on l'immerge dans une solution d'électroplaquage cathodique dans laquelle une couche de peinture non conductrice se dépose sur le substrat. Puis on durcit la couche de peinture non conductrice par cuisson à une température suffisante pour durcir la couche, mais insuffisante pour provoquer une déformation du substrat.
Designated States: European Patent Office (AT, BE, CH, DE, FR, GB, IT, LU, NL, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0324004