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1. (WO1987003773) METHOD FOR SELECTIVELY REMOVING ADHESIVES FROM POLYIMIDE SUBSTRATES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1987/003773 International Application No.: PCT/US1986/001967
Publication Date: 18.06.1987 International Filing Date: 22.09.1986
IPC:
C09K 13/00 (2006.01) ,H05K 3/00 (2006.01) ,H05K 1/00 (2006.01) ,H05K 1/03 (2006.01) ,H05K 3/38 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
13
Etching, surface-brightening or pickling compositions
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
38
Improvement of the adhesion between the insulating substrate and the metal
Applicants:
HUGHES AIRCRAFT COMPANY [US/US]; 7200 Hughes Terrace Los Angeles, CA 90045-0066, US
Inventors:
LEYDEN, Richard, N.; US
LAWRENCE, Robert; US
Agent:
LACHMAN, Mary, E. @; Hughes Aircraft Company Post Office Box 45066 Bldg. C1, M/S A126 Los Angeles, CA 90045-0066, US
Priority Data:
806,87409.12.1985US
Title (EN) METHOD FOR SELECTIVELY REMOVING ADHESIVES FROM POLYIMIDE SUBSTRATES
(FR) PROCEDES D'ELIMINATION SELECTIVE D'ADHESIFS SUR DES SUBSTRATS A BASE DE POLYIMIDE
Abstract:
(EN) Methods for forming holes of predetermined size in polyimide substrates having metallic layers adhesively attached thereto include selectively removing areas of desired size and shape from the metallic layer; contacting the exposed adhesive layer with a selective etchant therefor that does not affect the polyimide substrate or undercut the adhesive near the opening formed; and selectively etching the polyimide substrate exposed in the openings by removal of the adhesive layer overlying the polyimides. These methods permit rapid, efficient formation of holes having a diameter as small as one mil (0.00254 cm).
(FR) Procédés de formation de trous de taille prédéterminée dans des substrats à base de polyimide sur lesquels adhèrent des couches métalliques. Les procédés consistent à éliminer sélectivement de la couche métallique des zones de taille et de forme désirées; à mettre en contact la couche adhésive exposée avec un décapant sélectif qui n'affecte pas le substrat à base de polyimide ou qui n'affaiblit pas l'adhésif à proximité de l'ouverture formée; et à attaquer de manière sélective le substrat à base de polyimide exposé dans les ouvertures par l'élimination de la couche adhésive recouvrant le polyimide. Ces procédés permettent de former de manière rapide et efficiente des trous possédant un diamètre aussi petit qu'un mil (0,00254 cm).
Designated States: DK, JP
European Patent Office (DE, FR, GB, IT, NL)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0248029ES2003544