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1. (WO1986001067) METHOD OF AND APPARATUS FOR FORMING THICK-FILM CIRCUIT
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/1986/001067 International Application No.: PCT/JP1984/000380
Publication Date: 13.02.1986 International Filing Date: 26.07.1984
IPC:
H05K 3/12 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12
using printing techniques to apply the conductive material
Applicants: MAEDA, Yukio[JP/JP]; JP (UsOnly)
KUDOU, Shinichi[JP/JP]; JP (UsOnly)
KABESHITA, Akira[JP/JP]; JP (UsOnly)
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.[JP/JP]; 1006, Oaza Kadoma Kadoma-shi Osaka-fu 571, JP (AllExceptUS)
Inventors: MAEDA, Yukio; JP
KUDOU, Shinichi; JP
KABESHITA, Akira; JP
Agent: NAKAO, Toshio @; Matsushita Electric Industrial Co., Ltd. 1006, Oaza Kadoma Kadoma-shi Osaka-fu 571, JP
Priority Data:
Title (EN) METHOD OF AND APPARATUS FOR FORMING THICK-FILM CIRCUIT
(FR) PROCEDE ET DISPOSITIF DE PRODUCTION DE CIRCUITS A FILM EPAIS
Abstract:
(EN) A method of forming a thick-film circuit which employs a pattern drawing nozzle (102) for discharging a thick-film forming paste (101) that is formed with a paste discharge bore (104) having a substantially large width. The pattern forming nozzle (102) is rotated about the axis of rotation (108) as the thick-film forming paste (101) is discharged from the paste discharge bore (104) such that the longitudinal axis of the paste discharge bore (104) is substantially orthogonal to the advancing direction of the pattern drawing nozzle (102) relative to a substrate (100), whereby the thick-film forming paste (101) is attached to the surface of the substrate (100) in a desired pattern. Also disclosed is an apparatus suitably employed in the above-described method.
(FR) Procédé de production de circuits à film épais, utilisant un ajutage traceur de motifs (102) servant à décharger une pâte formant un film épais (101), l'ajutage possédant un trou de décharge de pâte (104) sensiblement grand. L'ajutage traceur de motifs (102) tourne autour de l'axe de rotation (108) à mesure que la pâte formant le film épais (101) est déchargée par le trou de décharge de pâte (104) de sorte que l'axe longitudinal du trou de décharge de pâte (104) est sensiblement orthogonal à la direction d'avance de l'ajutage traceur de motifs (102) par rapport à un substrat (100), la pâte formant le film épais (101) adhérant à la surface du substrat (100) selon un motif désiré. Est également décrit un dispositif indiqué pour exécuter ledit procédé.
Designated States: JP, US
European Patent Office (EPO) (AT, BE, CH, DE, FR, GB, LU, NL, SE)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)