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1. (WO1985004517) AUTOMATIC ASSEMBLY OF INTEGRATED CIRCUITS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1985/004517 International Application No.: PCT/US1985/000452
Publication Date: 10.10.1985 International Filing Date: 19.03.1985
IPC:
H01L 21/00 (2006.01) ,H05K 13/04 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04
Mounting of components
Applicants:
MOSTEK CORPORATION [US/US]; 1215 West Crosby Road Carrollton, TX 75006, US
Inventors:
MULHOLLAND, Wayne, A.; US
QUINN, Daniel, J.; US
BOND, Robert, H.; US
OLLA, Michael, A.; US
Agent:
PETRASKE, Eric, W.; Patent Department United Technologies Corporation Hartford, CT 06101, US
Priority Data:
592,18522.03.1984US
Title (EN) AUTOMATIC ASSEMBLY OF INTEGRATED CIRCUITS
(FR) MONTAGE AUTOMATIQUE DE CIRCUITS INTEGRES
Abstract:
(EN) A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simultaneously bonding all leads to the die.
(FR) Système pour le montage et le conditionnement de circuits intégrés utilisant des dés de circuit comportant des blocs de contact dans un réseau standard, cadre de montage comportant des conducteurs configurés de manière à avoir la même constante de ressort, procédé pour retirer des dés choisis d'un réseau de tranche sous le contrôle d'un ordinateur et procédé pour lier simultanément tous les conducteurs aux dés.
Designated States: JP, KR
European Patent Office (DE, FR, GB, NL)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0179801KR1019867000073