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Machine translation
1. (WO1985003815) MOUNTING OF SAW DEVICES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1985/003815    International Application No.:    PCT/GB1985/000073
Publication Date: 29.08.1985 International Filing Date: 20.02.1985
IPC:
H03H 3/08 (2006.01), H03H 9/05 (2006.01)
Applicants: BRITISH TELECOMMUNICATIONS PLC [GB/GB]; British Telecom Centre, 81 Newgate Street, London WC1A 7AJ (GB) (For All Designated States Except US).
ROGERSON, Stephen, Paul [GB/GB]; (GB) (For US Only).
MacDONALD, Brian, Michael [GB/GB]; (GB) (For US Only)
Inventors: ROGERSON, Stephen, Paul; (GB).
MacDONALD, Brian, Michael; (GB)
Agent: WOLFF, Eric; Intellectual Property Unit, British Telecom, 151 Gower Street, London WC1E 6BA (GB)
Priority Data:
8404398 20.02.1984 GB
8423857 20.09.1984 GB
Title (EN) MOUNTING OF SAW DEVICES
(FR) MONTAGE DE DISPOSITIFS D'ONDES ACOUSTIQUES SUPERFICIELLES
Abstract: front page image
(EN)A SAW device is formed by applying metallised areas (11) to a surface of a SAW substrate (10) and attaching conductive leads (18) to the metallised areas. The substrate is inverted and located on a hybrid circuit so that the leads (18) contact and are supported on conductive areas (30) of the circuit. This mounting arrangement minimises the stresses which occur in the substrate in its operational life. A novel shape for the device is also disclosed.
(FR)Un dispositif d'ondes acoustiques superficielles est formé par l'application de zones métallisées (11) sur une surface d'un substrat d'ondes acoustiques superficielles (10) et la fixation de lames conductrices (18) aux zones métallisées. Le substrat est inversé et situé sur un circuit hybride de telle manière que les lames (18) entrent en contact avec les zones conductrices (30) du circuit qui les soutiennent. Cette disposition de montage réduit les contraintes survenant dans le substrat au cours de sa durée de vie. Est également décrite une nouvelle forme pour le dispositif.
Designated States: DK, JP, US.
Publication Language: English (EN)
Filing Language: English (EN)