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Machine translation
1. (WO1985000670) THERMAL DEVELOPMENT OF PHOTOSENSITIVE MATERIALS EMPLOYING MICROENCAPSULATED RADIATION SENSITIVE COMPOSITIONS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1985/000670    International Application No.:    PCT/US1984/001188
Publication Date: 14.02.1985 International Filing Date: 23.07.1984
IPC:
B41M 5/28 (2006.01), G03F 7/00 (2006.01)
Applicants: THE MEAD CORPORATION [US/US]; Courthouse Plaza, NE, Dayton, OH 45463 (US)
Inventors: ADAIR, Paul, Clinton; (US).
McLAIN, Michael, Kenneth; (US)
Agent: LEVY, Mark, P. @; Biebel, French and Nauman, 2500 Kettering Tower, Dayton, OH 45423 (US)
Priority Data:
517,115 25.07.1983 US
Title (EN) THERMAL DEVELOPMENT OF PHOTOSENSITIVE MATERIALS EMPLOYING MICROENCAPSULATED RADIATION SENSITIVE COMPOSITIONS
(FR) DEVELOPPEMENT THERMIQUE DE MATERIAUX PHOTO-SENSIBLES UTILISANT DES COMPOSITIONS MICROENCAPSULEES SENSIBLES AUX RADIATIONS
Abstract: front page image
(EN)An improved means for developing photosensitive sheets employing a microencapsulated radiation sensitive composition wherein the microcapsules typically contain a thermally activatable gas generating compound and following exposure the imaging sheet is heated to rupture the microcapsules and develop the image.
(FR)Moyen amélioré de développement de feuilles photo-sensibles utilisant une composition microencapsulée sensible aux radiations, les microcapsules contenant généralement un composé gazogène pouvant être activé thermiquement. Après l'exposition, la feuille de mise en images est chauffée pour provoquer la rupture des microcapsules et le développement de l'image.
Designated States: AU, BR.
European Patent Office (AT, BE, CH, DE, FR, GB, LU, NL, SE).
Publication Language: English (EN)
Filing Language: English (EN)