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1. WO1985000075 - WAFER HEIGHT CORRECTION SYSTEM FOR FOCUSED BEAM SYSTEM

Publication Number WO/1985/000075
Publication Date 03.01.1985
International Application No. PCT/US1984/000772
International Filing Date 21.05.1984
IPC
H01J 37/20 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
02Details
20Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
H01J 37/21 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
02Details
21Means for adjusting the focus
H01L 21/68 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68for positioning, orientation or alignment
CPC
H01J 37/20
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
02Details
20Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
H01J 37/21
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
02Details
21Means for adjusting the focus
H01L 21/682
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
68for positioning, orientation or alignment
682Mask-wafer alignment
Applicants
  • HUGHES AIRCRAFT COMPANY [US]/[US]
Inventors
  • REEDS, John, W.
Agents
  • MILLER, Russell, Ben @
Priority Data
505,56317.06.1983US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) WAFER HEIGHT CORRECTION SYSTEM FOR FOCUSED BEAM SYSTEM
(FR) DISPOSITIF DE CORRECTION DE HAUTEUR DE MICROPLAQUETTE POUR SYSTEME A FAISCEAU FOCALISE
Abstract
(EN)
Base plate (32) of the wafer support is flexibly mounted with respect to the floor (34) of the target chamber. Flanges (54) and (58) flex by operation of motor (68) to adjust the position of the wafer support with respect to the focal point of the column.
(FR)
La plaque de base (32) du support de microplaquette est montée de manière flexible par rapport au plancher (34) de la chambre cible. Des rebords (54 et 58) fléchissent sous l'action du moteur (68) pour régler la position du support de microplaquette par rapport au point focal de la colonne.
Also published as
Latest bibliographic data on file with the International Bureau