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1. (WO1984000177) MAKING SOLDERABLE PRINTED CIRCUIT BOARDS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1984/000177 International Application No.: PCT/US1983/000931
Publication Date: 19.01.1984 International Filing Date: 13.06.1983
IPC:
H05K 3/24 (2006.01) ,H05K 3/34 (2006.01) ,H05K 3/06 (2006.01) ,H05K 3/10 (2006.01) ,H05K 3/42 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
24
Reinforcing of the conductive pattern
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
02
in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06
the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
40
Forming printed elements for providing electric connections to or between printed circuits
42
Plated through-holes
Applicants:
Inventors:
Priority Data:
null30.12.1899null
Title (EN) MAKING SOLDERABLE PRINTED CIRCUIT BOARDS
(FR) FABRICATION DE PLAQUES SOUDABLES A CIRCUIT IMPRIME
Abstract:
(EN) An improved process for making a printed circuit board (10) of the type comprising solder-rooted pads (12, 16, 20) and a solder-coated internal wall (12, 16, 20) of each hole (11) in the circuit board (10). The new process comprises the step of masking over a dry film, e.g. an alkaline ink film (18), after copper plating (16) and before solder plating (20).
(FR) Un procédé amélioré permet de fabriquer une plaque à circuit imprimé (10) du type comprenant des tampons à racine de soudure (12, 16, 20) et une paroi intérieure revêtue de soudure (12, 16, 20) de chaque trou (11) aménagé dans la plaque à circuit (10). Le nouveau procédé comprend l'étape de masquage avec un film sec, par exemple un film d'encre alcaline (18), après cuivrage (16) et avant placage de soudure (20).
Designated States:
Publication Language: English (EN)
Filing Language: English (EN)