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Machine translation
1. (WO1982004072) A METHOD FOR CHEMICALLY STRIPPING PLATINGS INCLUDING PALLADIUM AND AT LEAST ONE OF THE METALS COPPER AND NICKEL AND A BATH INTENDED TO BE USED FOR THE METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1982/004072    International Application No.:    PCT/SE1982/000154
Publication Date: 25.11.1982 International Filing Date: 06.05.1982
IPC:
C23F 1/44 (2006.01), H05K 3/06 (2006.01)
Applicants: TELEFONAKTIEBOLAGET L M ERICSSON [SE/SE]; S-126 25 Stockholm (SE) (For All Designated States Except US).
SKOWRONEK, Jerzy [SE/SE]; (SE) (For US Only).
PERSSON, Jan, Ola [SE/SE]; (SE) (For US Only)
Inventors: SKOWRONEK, Jerzy; (SE).
PERSSON, Jan, Ola; (SE)
Agent: GAMSTORP, Bengt @; Telefonaktiebolaget L M Ericsson, S-126 25 Stockholm (SE)
Priority Data:
8103205-4 21.05.1981 SE
Title (EN) A METHOD FOR CHEMICALLY STRIPPING PLATINGS INCLUDING PALLADIUM AND AT LEAST ONE OF THE METALS COPPER AND NICKEL AND A BATH INTENDED TO BE USED FOR THE METHOD
(FR) PROCEDE DE DEPOUILLAGE CHIMIQUE DE PLACAGES COMPRENANT DU PALLADIUM ET AU MOINS L'UN DES METAUX CUIVRE ET NICKEL ET BAIN DESTINE A ETRE UTILISE POUR CE PROCEDE
Abstract: front page image
(EN)Method for chemically stripping plated metals including palladium and at least one of the metals copper and nickel. The plating is submerged into a bath including 20-200 g/l nitric acid, 10-100 g/l hydrogen peroxide, another acid such as sulphuric acid or phosphoric acid which in the bath has a stable anion and which does not form a complex with the dissolved metal and suitably a hydrogen peroxide stabiliser. The temperature of the bath is between 20?o¿ and 50?o¿C.
(FR)Procédé de dépouillage chimique de métaux plaqués comprenant du palladium et au moins l'un des métaux cuivre ou nickel. Le placage est immergé dans un bain comprenant de 20 à 200g/l d'acide nitrique, de 10 à 100g/l de péroxyde d'hydrogène, un autre acide tel que de l'acide sulfurique ou phosphorique qui possède un anion stable dans le bain et qui ne forme pas de complexe avec le métal dissous, et un stabilisateur de péroxyde d'hydrogène. La température du bain se situe entre 20?o¿ et 50?o¿C.
Designated States: JP, US.
European Patent Office (AT, BE, CH, DE, FR, GB, NL).
Publication Language: English (EN)
Filing Language: English (EN)