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Machine translation
1. (WO1981003598) A UNITARY DIE-CAST ASSEMBLY FOR ELECTRONIC CIRCUITS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1981/003598    International Application No.:    PCT/US1981/000630
Publication Date: 10.12.1981 International Filing Date: 11.05.1981
IPC:
H05K 5/03 (2006.01), H05K 5/04 (2006.01), H05K 7/00 (2006.01)
Applicants:
Inventors:
Priority Data:
156296 04.06.1980 US
Title (EN) A UNITARY DIE-CAST ASSEMBLY FOR ELECTRONIC CIRCUITS
(FR) ENSEMBLE UNITAIRE COULE SOUS PRESSION POUR CIRCUITS ELECTRONIQUES
Abstract: front page image
(EN)Housing for electronic circuits. The housing is designed to deal with the problem caused by the fact that certain types of circuits are sensitive to acoustic vibrations of the housing and that some electronic components of the circuits need to be protected from the heat generated by other components in the housing. The housing includes a unitary die-cast (11) for enclosing electronic circuits within one or more compartments or cavities (13, 15) adapted to receive circuit boards therein. A cavity (15) includes a post (23) centrally located in the bottom and extending upwardly in the middle of the cavity. A fastening device, such as a screw (37), is used to forcibly affix a rigid but flexible cover (31) onto the housing at the center post. The cast and the cover are made of electrically conductive but acoustically dampening material. When the cover is forcibly affixed to cover the cavity, the cover and the chassis provide an acoustically and microphonically dampened housing for the circuit placed therein. The cast includes a wall (51) separating the compartments, and the wall has a cavity (53) along the length thereof and substantially co-extensive therewith for providing a thermal separation between the compartments whereby the wall acts as a thermal insulator.
(FR)Boitier pour circuits electroniques concu de maniere a resoudre le probleme pose par le fait que certains types de circuits sont sensibles aux vibrations acoustiques du boitier et que certains composants electroniques des circuits doivent etre proteges de la chaleur produite par d'autres composants a l'interieur du boitier. Le boitier comprend un moulage sous pression unitaire (11) permettant de renfermer des circuits electroniques a l'interieur d'un ou plusieurs compartiments ou cavites (13, 15) adaptes pour recevoir a l'interieur des plaques de circuits. Une qualite (15) comprend un montant (23) situe au centre du fond et s'etendant vers le haut au milieu de la cavite. Un dispositif de fixation, telle qu'une vis (37), sert a fixer de force sur le montant central un couvercle (31) rigide mais flexible pour le boitier. Le moulage et le boitier sont formes d'un materiau conducteur d'electricite mais acoustiquement absorbant. Lorsque le couvercle est fixe de force pour couvrir la cavite, le couvercle et le chassis forment un boitier amorti acoustiquement et microphoniquement pour le circuit place a son interieur. Le moulage comprend une paroi (51) servant de separation des compartiments, et la paroi possede une cavite (53) s'etendant sensiblement le long de toute sa longueur formant une separation thermique entre les compartiments, grace a laquelle la paroi sert d'isolant thermique.
Designated States:
Publication Language: English (EN)
Filing Language: English (EN)