WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO1981001912) FABRICATION OF CIRCUIT PACKAGES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1981/001912    International Application No.:    PCT/US1980/001698
Publication Date: 09.07.1981 International Filing Date: 22.12.1980
IPC:
H01L 21/58 (2006.01), H01L 23/498 (2006.01), H05K 3/34 (2006.01)
Applicants:
Inventors:
Priority Data:
107327 26.12.1979 US
Title (EN) FABRICATION OF CIRCUIT PACKAGES
(FR) FABRICATION D'ENSEMBLES DE CIRCUITS
Abstract: front page image
(EN)A method of fabricating circuit packages which employ macro-components (10) mounted on supporting substrates (20). In order to maintain sufficient clearance between the component and substrate and achieve high reliability bonds, massive solder spheres (16) are applied to contact pads (14) on either the component or substrate. After contact pads of both carrier and substrate are brought into contact with the spheres, the bond is formed by reflowing the solder while maintaining a component to substrate clearance of at least 0.25mm due to surface tension of the solder spheres.
(FR)Un procede de fabrication d'ensembles de circuits utilise des macro-composants (10) montes sur des substrats de support (20). De maniere a garder un degagement suffisant entre le composant et le substrat et obtenir des liaisons de haute fiabilite, des spheres massives de soudure (16) sont appliquees sur des cales de contact (14) soit sur le composant soit sur le substrat. Apres avoir ammene en contact les cales de contact du porteur et du substrat avec les spheres, la liaison est formee en fondant la soudure tout en maintenant un degagement entre le composant et le substrat d'au moins 0,25mm grace a la tension en surface des spheres de soudure.
Designated States:
Publication Language: English (EN)
Filing Language: English (EN)