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Machine translation
1. (WO1981001079) THIN FILM STRUCTURE FOR CERAMIC SUBSTRATES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1981/001079    International Application No.:    PCT/US1980/001202
Publication Date: 16.04.1981 International Filing Date: 15.09.1980
IPC:
H01L 21/268 (2006.01), H01L 27/01 (2006.01), H01P 1/205 (2006.01), H01P 11/00 (2006.01), H05K 1/00 (2006.01), H05K 1/03 (2006.01), H05K 3/02 (2006.01), H05K 3/38 (2006.01)
Applicants:
Inventors:
Priority Data:
84941 15.10.1979 US
Title (EN) THIN FILM STRUCTURE FOR CERAMIC SUBSTRATES
(FR) STRUCTURE A FILM MINCE POUR SUBSTRATS EN CERAMIQUE
Abstract: front page image
(EN)A thin film structure is provided with the capability of low-power laser tuning and trimming. Trim windows (14) in a plated ground plane (12) are incorporated to allow automated tuning procedures using relatively low-power lasers. The trim windows are conductive, but the heavier layer (25) of plated copper is omitted from those areas, leaving only the titanium/evaporated copper/gold layers (18, 20, 26). The method can also provide for areas (28) of bare substrate if desired.
(FR)Une structure a film mince est concue avec la capacite de syntonisation et de decoupage au laser de faible puissance. Des fenetres de decoupage (14) dans un plan de base plaque (12) sont amenagees pour permettre d'effectuer des syntonisations automatisees en utilisant des laser de puissance relativement faible. Les fenetres de decoupage sont conductrices, mais la couche la plus grosse (25) de cuivre plaque est omise de ces regions, laissant seulement les couches de titanium-cuivre evapore-or (18, 20, 26). Le procede peut egalement former des regions (28) de substrats a nu.
Designated States:
Publication Language: English (EN)
Filing Language: English (EN)