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Machine translation
1. (WO1981000981) METAL-BOUND DIAMOND SINTERED MATERIAL
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1981/000981    International Application No.:    PCT/JP1980/000242
Publication Date: 16.04.1981 International Filing Date: 08.10.1980
IPC:
B24D 3/06 (2006.01), B24D 3/08 (2006.01), C22C 26/00 (2006.01)
Applicants:
Inventors:
Priority Data:
79/130403 09.10.1979 JP
Title (EN) METAL-BOUND DIAMOND SINTERED MATERIAL
(FR) MATERIAU FRITTE DE DIAMANT A LIAISON METALLIQUE
Abstract: front page image
(EN)A nickel-copper series metal-bound diamond grinding material is provided. This sintered material comprises 2 to 30 wt.% of copper, 1 to 40 wt.% of tin, 0.2 to 3 wt.% of phosphorus, and balance (not less than 50 wt.%) of nickel retaining dispersed therein diamond and provides a metal-bound diamond grinding material which minimizes tooth-blocking and fluctuation in grinding amount.
(FR)Materiau de meulage a diamant a liaison de metaux de la serie nickel-cuivre. Ce materiau fritte comprend de 2 a 30% en poids de cuivre, 1 a 40% en poids d"etain, 0,2 a 3% en poids de phosphore, le reste (pas moins que 50% en poids) de nickel retenant le diamant contenu de maniere dispersee, et constitue un materiau de meulage a diamant a liaisons metalliques qui reduit au minimum le blocage des dents et la fluctuation de la quantite de matiere meulee au cours du meulage.
Designated States:
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)