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Machine translation
1. (WO1980001723) HEAT CURABLE COMPOSITIONS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1980/001723    International Application No.:    PCT/US1980/000097
Publication Date: 21.08.1980 International Filing Date: 01.02.1980
IPC:
C08G 59/68 (2006.01), C08G 65/10 (2006.01), C08G 77/08 (2006.01), C08G 85/00 (2006.01), C08L 61/00 (2006.01)
Applicants:
Inventors:
Priority Data:
11102 12.02.1979 US
Title (EN) HEAT CURABLE COMPOSITIONS
(FR) COMPOSITIONS THERMODURCISSABLES
Abstract: front page image
(EN)Heat curable compositions are provided comprising cationically polymerizable organic materials such as epoxy resins, vinyl ethers or phenol formaldehyde resins and thermal curing agents, based on the use of dialkyl hydroxyarylsulfonium salts with an organic oxidant, such as an organic peroxide, azonitriles, etc. The heat curable compositions can be used as injection molding compounds or as a coating composition.
(FR)Des compositions thermodurcissables comprennent des materiaux organiques polymerisables cationiquement tels que des resines epoxy, des vinyl ether ou des resines formaldehydes phenol et des agents de thermodurcissement, bases sur l"utilisation de sels d"hydroxyarylsulphonium de dialkyle avec un oxydant organique, comme un peroxyde organique, des azonitriles, etc. Des compositions thermodurcissables peuvent etre utilisees comme composes de moulage par injection ou comme compositions de revetement.
Designated States:
Publication Language: English (EN)
Filing Language: English (EN)