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Machine translation
1. (WO1980001220) THREE-DIMENSIONALLY STRUCTURED MICROELECTRONIC DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1980/001220    International Application No.:    PCT/US1979/001012
Publication Date: 12.06.1980 International Filing Date: 13.11.1979
IPC:
H01L 21/24 (2006.01), H01L 23/48 (2006.01), H01L 23/538 (2006.01), H01L 25/065 (2006.01)
Applicants:
Inventors:
Priority Data:
964547 29.11.1978 US
Title (EN) THREE-DIMENSIONALLY STRUCTURED MICROELECTRONIC DEVICE
(FR) DISPOSITIF MICROELECTRONIQUE A STRUCTURE TRIDIMENSIONNELLE
Abstract: front page image
(EN)A large scale parallel architecture in which many parallel channels operate simultaneously to create a natural and efficient organization for processing two-dimensional arrays of data. The architecture comprises a plurality of stack integrated circuit wafers (16, 18) having top and bottom surfaces, electric signal paths (20) extending through each of the wafers between the surfaces, and micro-interconnects (50) on the surfaces of adjacent wafers interconnecting the respective electric signal paths with a topographical one-to-one correspondence.
(FR)Dans une architecture parallele a grande echelle de nombreux canaux paralleles fonctionnent simultanement pour creer une organisation naturelle et efficace de traitement d"ensemble bidimensionnel de donnees. L"architecture comprend une pluralite de tranches de circuits integres empilees (16, 18) ayant des surfaces superieures et inferieures, des passages de signaux electriques (20) s"etendant au travers de chacune des tranches entre les surfaces, et des micro interconnections (50) sur les surfaces des tranches adjacentes interconnectant les passages de signaux electriques respectifs avec une correspondance topographique un-a-un.
Designated States:
Publication Language: English (EN)
Filing Language: English (EN)