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Machine translation
1. (WO1980000294) METHOD OF FABRICATING PRINTED CIRCUITS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1980/000294    International Application No.:    PCT/JP1979/000171
Publication Date: 21.02.1980 International Filing Date: 30.06.1979
IPC:
H05K 3/38 (2006.01), H05K 3/42 (2006.01), H05K 3/18 (2006.01)
Applicants:
Inventors:
Priority Data:
78/93172 01.08.1978 JP
Title (EN) METHOD OF FABRICATING PRINTED CIRCUITS
(FR) PROCEDE DE FABRICATION DE CIRCUITS IMPRIMES
Abstract: front page image
(EN)Printed circuits are fabricated by first providing an insulated substrate (12) having an adhesive layer (11) mainly composed of diene synthetic rubber with a roughened surface. The roughened surface (11a) of the adhesive layer (11) is then subjected to a corona discharge treatment, being followed by forming conductive patterns (14, 23) onto the surface of the adhesive layer (11) by chemical plating, thereby forming a printed circuit.
(FR)Des circuits imprimes sont fabriques en produisant un subtrat isole (12) ayant une couche adhesive (11) qui se compose principalement de caoutchouc synthetique diene avec une surface rendue rugueuse. La surface rendue rugueuse (11a) de la couche adhesive (11) est ensuite soumise a un traitement de decharge a corona, suivi de la formation de motifs conducteurs (14, 23) sur la surface de la couche adhesive (11) par placage chimique, formant ainsi un circuit imprime.
Designated States:
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)