Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO1980000117) SUBSTRATE FOR FLEXIBLE PRINTED CIRCUITS AND METHOD OF FABRICATING THE SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1980/000117 International Application No.: PCT/JP1979/000150
Publication Date: 24.01.1980 International Filing Date: 13.06.1979
IPC:
C08G 59/42 (2006.01) ,C08L 63/00 (2006.01) ,H05K 1/03 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
42
Polycarboxylic acids; Anhydrides, halides, or low-molecular-weight esters thereof
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
Inventors:
Priority Data:
78/7089514.06.1978JP
Title (EN) SUBSTRATE FOR FLEXIBLE PRINTED CIRCUITS AND METHOD OF FABRICATING THE SAME
(FR) SUBSTRAT POUR CIRCUIT IMPRIME FLEXIBLE ET SA METHODE DE FABRICATION
Abstract:
(EN) A substrate for flexible printed circuits obtained by coating a metal foil with an organic solvent solution of a heat resistant resin composition consisting of a heat resistant resin having an heterocyclic ring and epoxy resin and then drying the metal foil to thereby form a film directly on the foil as a material adapted for a flexible printed circuit board, and a method of fabricating the same. The printed circuit board exhibits heat resistance, fire retardance, adhesion, electric insulation and heat deterioration characteristics which are remarkably superior to the conventional circuit board which is obtained by integrating a heat resistant film with a metal foil via an adhesive. These properties are very important in practical use of the printed circuit board. The substrate of this invention is inexpensive since it can be easily fabricated as compared with the conventional one. This substrate can also be used for not only various flexible printed circuit boards but also as substrate for films alone.
(FR) Un substrat pour circuit imprime flexible est obtenu en revetant une feuille metallique avec une solution dans un solvant organique d"une composition de resine resistant a la chaleur consistant en une resine a resistance thermique ayant un noyau heterocyclique et une resine epoxy et en sechant la feuille metallique pour former ainsi un film directement sur la feuille, comme materiau approprie pour des plaques de circuit imprime flexible, et sa methode de fabrication. Cette plaque a circuit imprime presente des caracteristiques de resistance thermique, ignifuge, d"adhesion, d"isolation electrique, nettement superieures a celle de la plaque a circuit conventionnel qui est obtenue en combinant un film a haute resistance thermique et une feuille metallique par l"intermediaire d"un adhesif. Ces proprietes sont tres importantes dans l"utilisation pratique de la plaque a circuit imprime. Le substrat de cette invention est peu couteux puisqu"il est fabrique facilement en comparaison au substrat conventionnel. Ce substrat peut egalement etre utilise, non seulement pour des plaques a circuits imprimes flexibles, mais aussi comme substrat pour des films seuls.
Designated States:
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
US4353954