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1. (WO1980000116) MOUNTING SEMI-CONDUCTOR ELEMENTS WITH INSULATING ENVELOPE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1980/000116 International Application No.: PCT/CH1979/000068
Publication Date: 24.01.1980 International Filing Date: 16.05.1979
IPC:
H01L 23/051 (2006.01) ,H01L 23/10 (2006.01) ,H01L 23/16 (2006.01) ,H01L 23/48 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
04
characterised by the shape
043
the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
051
another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
10
characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
16
Fillings or auxiliary members in containers, e.g. centering rings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leadsĀ or terminal arrangements
Applicants:
Inventors:
Priority Data:
282568212.06.1978DE
Title (EN) MOUNTING SEMI-CONDUCTOR ELEMENTS WITH INSULATING ENVELOPE
(FR) ELEMENT SEMI-CONDUCTEUR DE MONTAGE AVEC ENVELOPPE ISOLANTE
Abstract:
(EN) In a power semiconductor element, for mounting according to the method of pressure contact and silver coupel of the type known from the DE-PS 20 39806, a pressure contact body (21, 22) is provided with grooves (25, 26) and, arranged within said grooves, are sealed rings (23, 24) located onto the inner wall on the insulating envelope (29). The arrangement withstands important temperature variations.
(FR) Pour un element semi-conducteur de puissance, de montage selon la methode de contact par pression et coupelle du genre connu par le DE-PS 20 39806, on prevoit un corps a contact par pression (21, 22) avec rainures (25, 26) et, disposes dans celles-ci, des joints d"etancheite en anneaux (23, 24) situes sur la paroi interne de l"enveloppe isolante (29). La disposition supporte des sollicitations de variation de temperatures importantes.
Designated States:
Publication Language: German (DE)
Filing Language: German (DE)