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1. (WO1979000814) SEMICONDUCTOR DEVICE COMPRISING TWO SEMICONDUCTOR ELEMENTS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1979/000814 International Application No.: PCT/DE1979/000011
Publication Date: 18.10.1979 International Filing Date: 27.01.1979
IPC:
H01L 23/49 (2006.01) ,H01L 25/07 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leadsĀ or terminal arrangements
488
consisting of soldered or bonded constructions
49
wire-like
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
Applicants:
Inventors:
Priority Data:
281270023.03.1978DE
Title (EN) SEMICONDUCTOR DEVICE COMPRISING TWO SEMICONDUCTOR ELEMENTS
(FR) DISPOSITIF SEMI-CONDUCTEUR COMPORTANT DEUX ELEMENTS SEMI-CONDUCTEURS
Abstract:
(EN) The semiconductor device comprises two circular semiconductor plates (10, 11) arranged one on the top of the other with, in between, a metal washer (12). Other me washers (13, 14) are placed respectively above t top plate (11) and below the bottom plate (10). On the metal washers (12, 13, 14), connection terminals (23, 24) are fixed said connection terminals coming out of the casing (20) on a same side. The stack of semiconductor plates (10, 11) and metal washers (12, 13, 14) is mounted, through a ceramic disc (16), on a base (26) provided with a threaded bolt (18). To ensure a good thermal conduction from the top semiconductor plate (11) to the base (26), the bottom semiconductor plate (10) has a bigger diameter. The top metal washer (13) presents a recess or an aperture allowing a control terminal (25) to come into contact with the top semiconductor plate (11).
(FR) Le dispositif semi-conducteur comporte deux plaquettes semi-conductrices circulaires (10, 11) disposees l"une sur l"autre avec, entre elles, une rondelle metallique (12). D"autres rondelles metalliques (13, 14) sont placees respectivement au-dessus de la plaquette superieure (11) et au-dessous de la plaquette inferieure (10). Sur les rondelles metalliques (12, 13, 14) sont fixees des bornes de connexion (23, 24) qui sortent du boitier (20) d"un meme cote. L"empilement des plaquettes semi-conductrices (10, 11) et rondelles metalliques (12, 13, 14) est monte, par l"intermediaire d"un disque en ceramique (16), sur un socle (26) muni d"un boulon filete (18). Pour garantir une bonne conduction de la chaleur de la plaquette semi-conductrice superieure (11) au socle (26), la plaquette semi-conductrice inferieure (10) possede un diametre plus grand. La rondelle metallique superieure (13) presente un evidement ou une ouverture permettant a une borne de commande (25) d"entrer en contact avec la plaquette semi-conductrice superieure (11).
Designated States:
Publication Language: German (DE)
Filing Language: German (DE)