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1. (WO1979000302) SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1979/000302 International Application No.: PCT/JP1978/000004
Publication Date: 31.05.1979 International Filing Date: 02.10.1978
IPC:
H01L 23/047 (2006.01) ,H01L 23/057 (2006.01) ,H01L 23/367 (2006.01) ,H01L 23/40 (2006.01) ,H01L 23/495 (2006.01) ,H01L 23/498 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
04
characterised by the shape
043
the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
047
the other leads being parallel to the base
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
04
characterised by the shape
053
the container being a hollow construction and having an insulating base as a mounting for the semiconductor body
057
the leads being parallel to the base
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367
Cooling facilitated by shape of device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
40
Mountings or securing means for detachable cooling or heating arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leadsĀ or terminal arrangements
488
consisting of soldered or bonded constructions
495
Lead-frames
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leadsĀ or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
Applicants:
Inventors:
Priority Data:
77/13848618.11.1977JP
Title (EN) SEMICONDUCTOR DEVICE
(FR) DISPOSITIF SEMI-CONDUCTEUR
Abstract:
(EN) A semiconductor device comprising a semiconductor element (102), a ceramic substrate (101) a ceramic frame (105) and a cover (106). One side of a penetrating opening of the ceramic substrate (101) is covered with highly thermally conductive metal plate (100) which is a laminated unit of a molybdenum plate (111) with a flexible metal plate (109). The semiconductor element (102) is loaded through a molybdenum plate (110) onto the lowest part of the depression formed by one face of the flexible metal plate (109) and the inside walls of the penetrating opening. Radiators (107, 108) are fixed to the side opposite to where the semiconductor element (102) is loaded.
(FR) Un dispositif semi-conducteur comprenant un element semi-conducteur (102), un substrat en ceramique (101), une armature en ceramique (105) et un couvercle (106). Un cote d"une ouverture de penetration pratiquee dans le substrat de ceramique (101) est couverte par une plaque metallique a haute conduction thermique (100) qui est un ensemble feuillete forme d"une plaque de molybdene (111) et d"une plaque metallique flexible (109). L"element semi-conducteur (102) est charge par l"intermediaire d"une plaque de molybdene (110) sur la partie inferieure de la cavite formee par une face de la plaque metallique flexible (109) et par les parois internes de l"ouverture de penetration. Des radiateurs (107, 108) sont fixes du cote oppose a celui ou l"element semi-conducteur (102) est charge.
Designated States:
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
US4340902