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1. US20120105175 - Surface acoustic wave resonator mounting with low acceleration sensitivity

Office United States of America
Application Number 12917738
Application Date 02.11.2010
Publication Number 20120105175
Publication Date 03.05.2012
Grant Number 08610517
Grant Date 17.12.2013
Publication Kind B2
IPC
H03H 9/05
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
02Details
05Holders or supports
H03H 9/205
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
15Constructional features of resonators consisting of piezo-electric or electrostrictive material
205having multiple resonators
H03H 9/25
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
25Constructional features of resonators using surface acoustic waves
H03B 5/32
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
BGENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
5Generation of oscillations using amplifier with regenerative feedback from output to input
30with frequency-determining element being electromechanical resonator
32being a piezo-electric resonator
Applicants Clark Roger L.
Raytheon Company
Berman Seth A.
Kozlowski Robert E.
Montress Gary K.
Inventors Clark Roger L.
Berman Seth A.
Kozlowski Robert E.
Montress Gary K.
Agents Daly, Crowley, Mofford & Durkee, LLP
Title
(EN) Surface acoustic wave resonator mounting with low acceleration sensitivity
Abstract
(EN)

A device, comprising a substrate having opposing first and second surfaces, a first surface acoustic wave resonator disposed on the first surface of the substrate, a second surface acoustic wave resonator disposed on the second surface of the substrate, a first adhesive layer sandwiched between the first surface acoustic wave resonator and the substrate, and a second adhesive layer sandwiched between the second surface acoustic wave resonator.