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1. (US20110281126) RESIN COMPOSITE COPPER FOIL

Office : United States of America
Application Number: 13142189 Application Date: 10.12.2009
Publication Number: 20110281126 Publication Date: 17.11.2011
Publication Kind : A1
Prior PCT appl.: Application Number:PCTJP2009071005 ; Publication Number: Click to see the data
IPC:
B32B 15/08
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
Applicants: Nozaki Mitsuru
Oomori Takabumi
Nomoto Akihiro
Akiyama Norikatsu
Nagata Eiji
Yano Masashi
Inventors: Nozaki Mitsuru
Oomori Takabumi
Nomoto Akihiro
Akiyama Norikatsu
Nagata Eiji
Yano Masashi
Priority Data: 2008-334408 26.12.2008 JP
Title: (EN) RESIN COMPOSITE COPPER FOIL
Abstract: front page image
(EN)

This invention relates to a resin composite copper foil capable of applying a copper foil with very small unevenness on a copper foil (matte) surface without deteriorating adhesion force to a resin composition of a copper-clad laminate, and more particularly to a resin composite copper foil comprising a copper foil and a polyimide resin layer wherein the polyimide resin layer contains a specific block copolymerized polyimide resin and an inorganic filler.


Also published as:
EP2371536JPWO2010073952CN102264539KR1020110100300KR1020170042670MYPI 2011003455
WO/2010/073952