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1. US20110192640 - Interconnect pattern for high performance interfaces

Office
United States of America
Application Number 12702823
Application Date 09.02.2010
Publication Number 20110192640
Publication Date 11.08.2011
Grant Number 08232480
Grant Date 31.07.2012
Publication Kind B2
IPC
H05K 1/11
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
Applicants Altera Corporation
Inventors Liu Hui
Agents Ward & Zinna, LLC
Title
(EN) Interconnect pattern for high performance interfaces
Abstract
(EN)

In one embodiment, differential signaling and ground contacts are located in a rectilinear array of rows and columns with ground contacts spaced apart by three times the pitch distance between adjacent rows or columns and signaling contacts are located immediately adjacent the ground contacts. In particular, the two contacts of each differential pair are located one pitch distance apart from each other and one contact of each differential pair of contacts is located one pitch distance from a ground contact and the other contact of the differential pair is located approximately sqrt(2)*pitch distance from the same ground contact. In a second embodiment, differential signaling and ground contacts are located in a hexagonal array with ground contacts located three times the pitch distance between adjacent contacts and signaling contacts located immediately adjacent the ground contacts. In particular, the two contacts of each differential pair are located one pitch distance apart from each other and both contacts of each differential pair of contacts are located one pitch distance from a ground contact.


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