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1. US20100186226 - FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION

Office United States of America
Application Number 12305365
Application Date 25.06.2007
Publication Number 20100186226
Publication Date 29.07.2010
Publication Kind A1
IPC
H05K 3/30
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
Applicants UNIVERSITY OF WASHINGTON, THE
Inventors Amirparviz Babak
Stauth Sean
Agents CHRISTENSEN, O'CONNOR, JOHNSON, KINDNESS, PLLC
Title
(EN) FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION
Abstract
(EN)

A method for self-assembly is disclosed that accomplishes the assembly process in one step, obviating or mitigating the need for post-processing of an assembled macro-electronic device. Microcomponents are fabricated having a particular shape, and a template with embedded interconnects is fabricated having recessed binding sites that are sized to receive particular microcomponent types. The binding sites include a low melting point alloy for electrically connecting received microcomponents to the interconnect network. The template is placed in a liquid, and the microcomponents are introduced to the liquid such that the microcomponents flow or slide along the template propelled by gravity and/or fluid-dynamic forces and some of them are received into the binding sites, and retained by capillary forces. The liquid is heated before or after introduction of the microcomponents to melt the alloy. The fluid and/or template are then cooled to harden the alloy, binding the microcomponents.

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