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1. (US20100078636) Semiconductor device with backside tamper protection

Office : United States of America
Application Number: 12527551 Application Date: 13.02.2008
Publication Number: 20100078636 Publication Date: 01.04.2010
Grant Number: 08198641 Grant Date: 12.06.2012
Publication Kind : B2
Prior PCT appl.: Application Number:PCTIB2008050514 ; Publication Number: Click to see the data
IPC:
H01L 33/00
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Applicants: NXP B.V.
Inventors: Zachariasse Frank
Priority Data: 07102697 20.02.2007 EP
Title: (EN) Semiconductor device with backside tamper protection
Abstract: front page image
(EN)

A tamper-resistant semiconductor device (5;20;30;40;50;60) which includes a plurality of electronic circuits formed on a circuitry side (6) of a substrate (7) having an opposite side which is a backside (8) of the semiconductor device, and comprises at least one light-emitting device (9a-f;21) and at least one light-sensing device (10a-f;22a-b) provided on the circuitry side (6) of the semiconductor device. The light-emitting device (9a-f;21) is arranged to emit light, including a wavelength range for which the substrate (7) is transparent, into the substrate towards the backside (8), and the light-sensing device (10a-f;22a-b) is arranged to sense at least a fraction of the emitted light following passage through the substrate (7) and reflection at the backside (8), and configured to output a signal indicative of a reflecting state of the backside, thereby enabling detection of an attempt to tamper with the backside (8) of the semiconductor device (5;20;30;40;50;60). Through the present invention, a semiconductor device can be equipped with a backside tamper protection which neither restricts the field of application of the semiconductor device, nor the choice of packaging of the device.


Also published as:
EP2115652CN101617319WO/2008/102282