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1. US20100078636 - Semiconductor device with backside tamper protection

Office United States of America
Application Number 12527551
Application Date 13.02.2008
Publication Number 20100078636
Publication Date 01.04.2010
Grant Number 08198641
Grant Date 12.06.2012
Publication Kind B2
IPC
H01L 33/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Applicants NXP B.V.
Inventors Zachariasse Frank
Priority Data 07102697 20.02.2007 EP
Title
(EN) Semiconductor device with backside tamper protection
Abstract
(EN)

A tamper-resistant semiconductor device (5;20;30;40;50;60) which includes a plurality of electronic circuits formed on a circuitry side (6) of a substrate (7) having an opposite side which is a backside (8) of the semiconductor device, and comprises at least one light-emitting device (9a-f;21) and at least one light-sensing device (10a-f;22a-b) provided on the circuitry side (6) of the semiconductor device. The light-emitting device (9a-f;21) is arranged to emit light, including a wavelength range for which the substrate (7) is transparent, into the substrate towards the backside (8), and the light-sensing device (10a-f;22a-b) is arranged to sense at least a fraction of the emitted light following passage through the substrate (7) and reflection at the backside (8), and configured to output a signal indicative of a reflecting state of the backside, thereby enabling detection of an attempt to tamper with the backside (8) of the semiconductor device (5;20;30;40;50;60). Through the present invention, a semiconductor device can be equipped with a backside tamper protection which neither restricts the field of application of the semiconductor device, nor the choice of packaging of the device.