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1. (US20100212830) Thermosetting solvent-free single-component compositions and their use

Office : United States of America
Application Number: 11994113 Application Date: 03.07.2006
Publication Number: 20100212830 Publication Date: 26.08.2010
Grant Number: 08480845 Grant Date: 09.07.2013
Publication Kind : B2
Prior PCT appl.: Application Number:PCTEP2006006447 ; Publication Number: Click to see the data
IPC:
C09J 163/00
B05D 3/02
C08G 18/08
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
3
Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
02
by baking
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
18
Polymeric products of isocyanates or isothiocyanates
06
with compounds having active hydrogen
08
Processes
Applicants: Stumbeck Michael
Delo Industrieklebstoffe GmbH & Co. KG
Koebler Juergen
Inventors: Stumbeck Michael
Koebler Juergen
Agents: Hayes Soloway P.C.
Priority Data: 10 2005 031 381 05.07.2005 DE
Title: (EN) Thermosetting solvent-free single-component compositions and their use
Abstract: front page image
(EN)

We propose a thermosetting solvent-free single-component composition having a storage stability at room temperature of at least 2 weeks, consisting of

    • (A) 5-90 parts by weight of one at least difunctional (iso)cyanate component,
    • (B) 5-50 parts by weight of a latent curing agent solid up to a temperature of at least 40° C. based on nitrogen compounds suitable for addition crosslinking,
    • (C) 0-50 parts by weight of an epoxy-containing compound and
    • (D) 0-50 parts by weight of modifiers,
    • with the sum of all parts by weight being 100, and its use for bonding, casting, sealing and coating of substrates, in particular electronic parts. The composition is cured at 120° C. to 150° C. within seconds.


Also published as:
EP1899431CN101253249IN488/KOLNP/2008WO/2007/003392