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1. US20100123268 - Printing semiconductor elements by shear-assisted elastomeric stamp transfer

Office
United States of America
Application Number 12621804
Application Date 19.11.2009
Publication Number 20100123268
Publication Date 20.05.2010
Grant Number 08506867
Grant Date 13.08.2013
Publication Kind B2
IPC
B29C 59/00
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59Surface shaping, e.g. embossing; Apparatus therefor
Applicants Menard Etienne
Semprius, Inc.
Inventors Menard Etienne
Agents Lathrop & Gage LLP
Title
(EN) Printing semiconductor elements by shear-assisted elastomeric stamp transfer
Abstract
(EN)

Provided are methods and devices for transfer printing of semiconductor elements to a receiving surface. In an aspect, the printing is by conformal contact between an elastomeric stamp inked with the semiconductor elements and a receiving surface, and during stamp removal, a shear offset is applied between the stamp and the receiving surface. The shear-offset printing process achieves high printing transfer yields with good placement accuracy. Process parameter selection during transfer printing, including time varying stamp-backing pressure application and vertical displacement, yields substantially constant delamination rates with attendant transfer printing improvement.


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