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1. US20090020733 - CONDUCTIVE PASTE

Office
United States of America
Application Number 11814535
Application Date 20.01.2006
Publication Number 20090020733
Publication Date 22.01.2009
Publication Kind A1
IPC
H01B 1/14
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
14Conductive material dispersed in non-conductive inorganic material
H01B 1/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
14Conductive material dispersed in non-conductive inorganic material
16the conductive material comprising metals or alloys
Applicants FUJIKURA KASEI CO., LTD.
ASAHI KASEI EMD CORPORATION
Inventors Hirakawa Yohei
Wakabayashi Katsutomo
Yotsuyanagi Yuta
Tanaka Norihito
Agents WOOD, HERRON &; EVANS, LLP
Priority Data 2005016965 25.01.2005 JP
Title
(EN) CONDUCTIVE PASTE
Abstract
(EN)

A conductive paste that includes a binder containing a thermosetting resin and conductive particles, in which the lowest exothermic peak temperature T1 (degrees C.) among at least one exothermic peak obtained by differential scanning calorimetry of the binder and the lowest endothermic peak temperature t1 (degrees C.) among at least one endothermic peak obtained by differential scanning calorimetry of the conductive particles satisfy the relation t1−20<;T1 . . . (1), thereby achieving good conductivity and excellent conductive connection reliability.