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1. US20090124175 - Double-side polishing method for wafer

Office United States of America
Application Number 11988830
Application Date 28.06.2006
Publication Number 20090124175
Publication Date 14.05.2009
Grant Number 7727053
Grant Date 01.06.2010
Publication Kind B2
IPC
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
1
Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
B24B 1/00
CPC
B24B 37/08
H01L 21/02024
Applicants Shin-Etsu Handotai Co., Ltd.
Inventors Ueno Junichi
Kobayashi Syuichi
Agents Oliff & Berridge PLC
Priority Data 2005209216 19.07.2005 JP
Title
(EN) Double-side polishing method for wafer
Abstract
(EN)

There is provided a double-side polishing method for a wafer of sandwiching a wafer held in a carrier between upper and lower turn tables each having a polishing pad attached thereto and simultaneously polishing both surfaces of the wafer while supplying a slurry to a space between the upper and lower turn tables from a plurality of slurry supply holes provided in the upper turn table, wherein a polishing amount at an outer peripheral portion of the wafer to be polished is adjusted and outer peripheral sag of the wafer is suppressed by supplying the slurry in such a manner that an amount of the slurry supplied from the slurry supply holes provided on an outer side relative to the center of rotation of the upper turn table becomes larger than an amount of the slurry supplied from the slurry supply holes provided on an inner side relative to the same at the time of polishing both the surfaces of the wafer. As a result, the double-side polishing method which can suppress occurrence of the outer peripheral sag of the wafer when the wafer is subjected to double-side polishing can be provided.