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1. US20090171061 - Phenol resin and resin composition

Office
United States of America
Application Number 12162277
Application Date 24.01.2007
Publication Number 20090171061
Publication Date 02.07.2009
Grant Number 08642714
Grant Date 04.02.2014
Publication Kind B2
IPC
C08G 8/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
8Condensation polymers of aldehydes or ketones with phenols only
04of aldehydes
Applicants Sue Haruaki
Hitachi Chemical Company, Ltd.
Satou Kuniaki
Matsuzaka Osamu
Inventors Sue Haruaki
Satou Kuniaki
Matsuzaka Osamu
Agents Griffin & Szipl, P.C.
Priority Data P2006-016212 25.01.2006 JP
Title
(EN) Phenol resin and resin composition
Abstract
(EN)

The present invention provides a phenol resin having, as a unit in its main-chain skeleton, a structure represented by the following general formula (I), as well as a resin composition using the same. According to the phenol resin of the invention, epoxylation thereof, chemical modification thereof, reaction thereof with an epoxy resin, and the like are facilitated. Phenol resins ranging from low-molecular-weight resins rich in fluidity to high-melting resins can be synthesized, and these phenol resins are industrially useful. When the phenol resin of the present invention is used as a hardening agent for epoxy resin etc., its resin composition can give a cured product of high Tg without deteriorating adhesiveness.

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