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1. (US20080136045) Stacked die in die BGA package

Office : United States of America
Application Number: 12020738 Application Date: 28.01.2008
Publication Number: 20080136045 Publication Date: 12.06.2008
Grant Number: 08373277 Grant Date: 12.02.2013
Publication Kind : B2
IPC:
H01L 23/12
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
Applicants: Tan Hock Chuan
Micron Technology, Inc.
Lim Thiam Chye
Tan Victor Cher Khng
Neo Chee Peng
Tan Michael Kian Shing
Chew Beng Chye
Pour Cheng Poh
Inventors: Tan Hock Chuan
Lim Thiam Chye
Tan Victor Cher Khng
Neo Chee Peng
Tan Michael Kian Shing
Chew Beng Chye
Pour Cheng Poh
Agents: TraskBritt
Priority Data: 200200134-5 09.01.2002 SG
Title: (EN) Stacked die in die BGA package
Abstract: front page image
(EN)

Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.


Also published as:
US20030207515US20030148597US20060292743US20080096316US20080032449AU2003207484
WO/2003/061006