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1. (US20080093117) Multilayer circuit board and manufacturing method thereof

Office : United States of America
Application Number: 11968700 Application Date: 03.01.2008
Publication Number: 20080093117 Publication Date: 24.04.2008
Grant Number: 7847197 Grant Date: 07.12.2010
Publication Kind : B2
Prior PCT appl.: Application Number:JP06308084 ; Publication Number: Click to see the data
IPC:
H01R 12/04
H01K 3/10
H05K 1/11
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12
Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
02
Structural associations of a plurality of mutually-insulated electrical connecting elements
04
specially adapted for rigid printed circuits
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
K
ELECTRIC INCANDESCENT LAMPS
3
Apparatus or processes adapted to the manufacture, installing, removal or maintenance of incandescent lamps or parts thereof
08
Manufacture of mounts or stems
10
Machines therefor
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
11
Printed elements for providing electric connections to or between printed circuits
Applicants: Murata Manufacturing Co., Ltd.
Inventors: Oikawa Yoshikazu
Yoshikawa Takayoshi
Agents: Keating &; Bennett, LLP
Priority Data: 2005203443 12.07.2005 JP
Title: (EN) Multilayer circuit board and manufacturing method thereof
Abstract: front page image
(EN)

A multilayer circuit board includes a laminate having a plurality of ceramic layers, and a wiring pattern disposed in the laminate, wherein a ceramic layer includes, as the wiring pattern, a fully penetrating via-hole conductor that vertically passes through the ceramic layers, and a serial partially penetrating via-hole conductor that is electrically connected to the fully penetrating via-hole conductor in the ceramic layers and does not pass completely through the ceramic layers.


Also published as:
JPWO2007007451JP2011009786JP4748161CN101213890WO/2007/007451