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1. US20080218934 - Method of Manufacturing a Microsystem, Such a Microsystem, a Stack of Foils Comprising Such a Microsystem, an Electronic Device Comprising Such a Microsystem and Use of the Electronic Device

Office
United States of America
Application Number 12065774
Application Date 24.08.2006
Publication Number 20080218934
Publication Date 11.09.2008
Publication Kind A1
IPC
H01G 7/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
7Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
B32B 37/30
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
30Partial laminating
Applicants KONINKLIJKE PHILIPS ELECTRONICS, N.V.
Inventors Langereis Geert
Weekamp Johannes Wilhelmus
Giesbers Jacobus Bernardus
Agents PHILIPS INTELLECTUAL PROPERTY &; STANDARDS
Priority Data 05108280 09.09.2005 EP
Title
(EN) Method of Manufacturing a Microsystem, Such a Microsystem, a Stack of Foils Comprising Such a Microsystem, an Electronic Device Comprising Such a Microsystem and Use of the Electronic Device
Abstract
(EN)

The invention relates to a method of manufacturing a microsystem and further to such microsystem. With the method a microsystem can be manufactured by stacking pre-processed foils (10) having a conductive layer (11a, 11b) on at least one side. After stacking, the foils (10) are sealed, using pressure and heat. Finally the microsystems are separated from the stack (S). The pre-processing of the foils (preferably done by means of a laser beam) comprises a selection of the following steps: (A) leaving the foil intact, (B) locally removing the conductive layer, (C) removing the conductive layer and partially evaporating the foil (10), and (D) removing both the conductive layer as well as foil (10), thus making holes in the foil (10). In combination with said stacking, it is possible to create cavities, freely suspended cantilevers and membranes. This opens up the possibility of manufacturing various microsystems, like MEMS devices and microfluidic systems.