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1. US20060240680 - Substrate processing platform allowing processing in different ambients

Office
United States of America
Application Number 11114250
Application Date 25.04.2005
Publication Number 20060240680
Publication Date 26.10.2006
Publication Kind A1
IPC
H01L 21/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Applicants APPLIED MATERIALS, INC.
Inventors Yokota Yoshitaka
Moritz Kirk
Ma Kai
Chang Wen
Parasiris Anastasios
Sharma Rohit
Tjandra Agus
Achutharaman Vedapuram
Ramamurthy Sundar
Thakur Randhir
Agents LAW OFFICES OF CHARLES GUENZER;ATTN: APPLIED MATERIALS, INC.
Priority Data 11114250 25.04.2005 US
Title
(EN) Substrate processing platform allowing processing in different ambients
Abstract
(EN)

A semiconductor wafer processing system including a factory interface operating at atmospheric pressure and mounting plural wafer cassettes and plural wafer processing chambers connected to the factory interface through respective slit valves. A robot in the factory interface can transfer wafers between the cassettes and the processing chambers. At least one of the processing chambers can operate at reduced pressure The processing chamber may be a rapid thermal processing chamber including an array of lamps irradiating a processing volume through a window. The lamphead is vacuum pumped to a pressure approximating that in the processing volume. A multi-step process may be performed with different pressures. The invention also includes a wafer access port of a thermal processing chamber which can flow an inert gas in outside of the slit valve to thereby form a gas curtain outside of the opened slit to prevent the out flow of toxic processing gases.


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