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1. US20030197256 - Power conditioning substrate stiffener

Office
United States of America
Application Number 10341906
Application Date 13.01.2003
Publication Number 20030197256
Publication Date 23.10.2003
Publication Kind A1
IPC
H01L 23/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
H01L 25/065
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/78
H01L 25/07
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
07the devices being of a type provided for in group H01L29/78
Inventors Pommer Richard
Agents Sandra P. Thompson RIORDAN &; MCKINZIE
Title
(EN) Power conditioning substrate stiffener
Abstract
(EN)

Utilization of the “dead space” previously occupied by a metal stiffener in an integrated circuit package as a location for power conditioning and converting mechanisms such as decoupling capacitors and planar transformers.


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