US20030197256 Power conditioning substrate stiffener

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United States of America

Application Number 10341906

Application Date 13.01.2003

Publication Number 20030197256

Publication Date 23.10.2003

Publication Kind A1

IPC

Inventors Pommer Richard

Agents Sandra P. Thompson RIORDAN &; MCKINZIE

Priority Data 09512969 24.02.2000 US
10341906 13.01.2003 US

Title

(EN) Power conditioning substrate stiffener

Abstract

(EN)

Utilization of the “dead space” previously occupied by a metal stiffener in an integrated circuit package as a location for power conditioning and converting mechanisms such as decoupling capacitors and planar transformers.

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23	Details of semiconductor or other solid state devices
02	Containers; Seals

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25	Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03	all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04	the devices not having separate containers
065	the devices being of a type provided for in group H01L27/78

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25	Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03	all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04	the devices not having separate containers
07	the devices being of a type provided for in group H01L29/78

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23	Details of semiconductor or other solid state devices
02	Containers; Seals

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25	Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03	all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04	the devices not having separate containers
065	the devices being of a type provided for in group H01L27/78

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1. US20030197256 - Power conditioning substrate stiffener