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1. US6460414 - Automated acoustic micro imaging system and method

Office United States of America
Application Number 09715359
Application Date 17.11.2000
Publication Number 6460414
Publication Date 08.10.2002
Grant Number 6460414
Grant Date 08.10.2002
Publication Kind B1
IPC
B65H 1/00
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
1Supports or magazines for piles from which articles are to be separated
C01N 29/04
G01N 29/22
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
22Details
F26B 19/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
26DRYING
BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
19Machines or apparatus for drying solid materials or objects not covered by groups F26B9/-F26B17/134
G01N 29/28
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
22Details
28providing acoustic coupling
H01L 21/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
CPC
H01L 21/67288
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67242Apparatus for monitoring, sorting or marking
67288Monitoring of warpage, curvature, damage, defects or the like
G01N 29/223
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
22Details ; , e.g. general constructional or apparatus details
223Supports, positioning or alignment in fixed situation
G01N 29/225
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
22Details ; , e.g. general constructional or apparatus details
225Supports, positioning or alignment in moving situation
G01N 29/28
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
22Details ; , e.g. general constructional or apparatus details
28providing acoustic coupling ; , e.g. water
G01N 2291/2697
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
2291Indexing codes associated with group G01N29/00
26Scanned objects
269Various geometry objects
2697Wafer or (micro)electronic parts
H01L 21/67778
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67763the wafers being stored in a carrier, involving loading and unloading
67778involving loading and unloading of waers
Applicants Sonoscan, Inc.
Inventors Erickson, Daniel M.
Micek, Daniel W.
Oravecz, Michael G.
Agents Welsh & Katz, Ltd.
Coult, John H.
Priority Data 09715359 17.11.2000 US
Title
(EN) Automated acoustic micro imaging system and method
Abstract
(EN)

An automated acoustic micro imaging system includes a part-storage station favoring a dry environment, a part-transport robot, and a wet-environment inspection station. The wet-environment inspection station has an ultrasonic beam generator, a coupling fluid in which parts are inspected, and a part-retention stage. A moisture barrier is located between the wet-environment inspection station and the part-storage station favoring a dry environment. The inspection station includes a kinematic, quick-change part-retaining chuck and robotic means for interchanging chucks. Automatic acoustic micro imaging methods are disclosed.

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