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1. US5884640 - Method and apparatus for drying substrates

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United States of America
Application Number 08908245
Application Date 07.08.1997
Publication Number 5884640
Publication Date 23.03.1999
Grant Number 5884640
Grant Date 23.03.1999
Publication Kind A
IPC
B08B 5/00
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
5Cleaning by methods involving the use of air flow or gas flow
B08B 3/04
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3Cleaning by methods involving the use or presence of liquid or steam
04Cleaning involving contact with liquid
F26B 5/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
26DRYING
BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
5Drying solid materials or objects by processes not involving the application of heat
F26B 9/06
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
26DRYING
BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
9Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards
06in stationary drums or chambers
F26B 21/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
26DRYING
BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
21Arrangements for supplying or controlling air or gases for drying solid materials or objects
H01L 21/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
CPC
H01L 21/68728
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68714the wafers being placed on a susceptor, stage or support
68728characterised by a plurality of separate clamping members, e.g. clamping fingers
H01L 21/67034
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
67034for drying
Y10S 134/902
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
134Cleaning and liquid contact with solids
902Semiconductor wafer
Applicants Applied Materials, Inc.
Inventors Fishkin Boris
Hearne John S.
Lowrance Robert B.
Agents Janah & Associates
Title
(EN) Method and apparatus for drying substrates
front page image
Abstract
(EN)

A drying apparatus 20 for removing residual liquid from a substrate surface comprises a vapor chamber 25 having a vapor distributor 30 for introducing vapor into the chamber. The drying apparatus 20 further comprises a fluid system 35 comprising (i) a reservoir 40, (ii) a fluid dispenser 45 for introducing fluid into the reservoir, and (iii) a fluid level adjuster 50 for lowering a fluid surface level in the reservoir 40. A multi-point holder 62 is used for holding the substrate 55 at different holding points 63 on the substrate, while the fluid surface level is lowered relative to the substrate, so that residual liquid flows off the substrate surface without intersection of the lowering fluid surface level with holding points 63 on the substrate. The drying apparatus 20 dries substrates 55 substantially without forming stains or streaks, or causing contamination or liquid residue to remain on the substrate 55.
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